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Enhanced adhesion from high energy ion irradiation

机译:高能离子辐照增强附着力

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摘要

We have found that irradiation of a variety of thin film-substrate combinations by heavy ion beams at energies of mega-electronvolts per atomic mass unit will produce a remarkable enhancement in the adherence of the film. For example, gold films can be firmly attached to soft materials such as Teflon using a 1 MeV beam of protons (10^(14) cm^(−2)) or helium ions (10^(13) cm^(−2)) and to harder materials such as silicon (10^(15) cm^(−2)), quartz (2 × 10^(15) cm^(−2)) and tungsten (2 × 10^(14) cm^(−2)) with 0.5 MeV a.m.u.^(−1) beams of fluorine or chlorine ions. In the case of metal films on semiconductors a low resistance contact results. The mixed layer at the interface is observed to be quite thin (approximately 50 Å or less); for silver on silicon electron diffraction and imaging studies of the interface region reveal the presence of crystalline silver compounds.
机译:我们已经发现,重离子束以每原子质量单位兆电子伏特的能量辐照各种薄膜-基板组合将显着提高膜的粘附性。例如,金膜可以使用1 MeV质子束(10 ^(14)cm ^(-2))或氦离子(10 ^(13)cm ^(-2)牢固地附着到特氟隆等软材料上)以及更坚硬的材料,例如硅(10 ^(15)cm ^(− 2)),石英(2×10 ^(15)cm ^(-2))和钨(2×10 ^(14)cm ^ (-2))具有0.5 MeV amu ^(-1)的氟或氯离子束。在半导体上的金属膜的情况下,导致低电阻接触。观察到界面处的混合层非常薄(大约50埃或更小)。用于硅上银的电子衍射和界面区域成像研究表明,存在结晶银化合物。

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