Development of electroplating process for plating polyamides

机译：电镀聚酰胺电镀过程的开发

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MV Kulkarni; K Elangovan; KH Reddy;
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1. Development of electroplating process for plating polyamides [J] . MV Kulkarni, K Elangovan, KH Reddy Bangladesh Journal of Scientific and Industrial Research . 2013,第3期

机译：开发用于电镀聚酰胺的电镀工艺
2. Balancing of plating solution in CuCN electroplating process [J] . In Kwon Hong, Jung Woo Park, Seung Bum Lee Journal of industrial and engineering chemistry . 2014,第5期

机译：CuCN电镀过程中电镀液的平衡
3. Void control during plating process and thermal annealing of through-mask electroplated copper interconnects [J] . Chunsheng Zhu, Wenguo Ning, Heng Li, Microelectronics & Reliability . 2014,第4期

机译：镀覆过程中的空隙控制和通孔电镀铜互连的热退火
4. Electroplating and Electroless Plating Process Development for DuPont GreenTape 9K7 LTCC [C] . Allan Beikmohamadi, Steve Stewart, Jim Parisi, IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies . 2013

机译：杜邦Greentape的电镀和化学镀工艺开发9K7 LTCC
5. The structure and composition of an electroplated gold-tin solder alloy co-deposited by pulse plating from solutions containing ethylendiamine as a stabilizer [D] . Doesburg, Jacobus Cornelis 2000

机译：通过脉冲电镀法从含有乙二胺作为稳定剂的溶液中共沉积的电镀金锡焊料合金的结构和组成
6. Aquatic toxicity of particulate matter emitted by five electroplating processes in two marine microalgae species [O] . Konstantin Pikula, Konstantin Kirichenko, Igor Vakhniuk, 2021

机译：两种海洋微藻物种中五种电镀过程发出的颗粒物质水生毒性
7. A New Zinc-Nickel Electroplating Process: Alternative to Cadmium Plating [O] . Grace F. Hsu, Seattle Wa 2014

机译：一种新的锌镍电镀工艺：替代镉电镀
8. Electroplating connector ends on tape-processed slapper detonator cables: Improvements on plating head design [R] . Bruns, R. J., Tomasoski, R. J. 1994

机译：电镀连接器端部在带式处理的板条雷管电缆上：电镀头设计的改进

Development of electroplating process for plating polyamides

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