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Interface engineering of the photoelectrochemical performance of Ni-oxide-coated n-Si photoanodes by atomic-layer deposition of ultrathin films of cobalt oxide

机译:原子层沉积氧化钴超薄膜制备镍氧化物包覆的n-Si光电阳极的光电化学性能的界面工程

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摘要

Introduction of an ultrathin (2 nm) film of cobalt oxide (CoO_x) onto n-Si photoanodes prior to sputter-deposition of a thick multifunctional NiO_x coating yields stable photoelectrodes with photocurrent-onset potentials of ~−240 mV relative to the equilibrium potential for O2(g) evolution and current densities of ~28 mA cm^(−2) at the equilibrium potential for water oxidation when in contact with 1.0 M KOH(aq) under 1 sun of simulated solar illumination. The photoelectrochemical performance of these electrodes was very close to the Shockley diode limit for moderately doped n-Si(100) photoelectrodes, and was comparable to that of typical protected Si photoanodes that contained np+ buried homojunctions.
机译:在溅射沉积厚多功能NiO_x涂层之前,将氧化钴(CoO_x)的超薄(2 nm)膜引入n-Si光电阳极,可产生稳定的光电极,其光电流起始电势约为-240 mV,相对于平衡电势为当在模拟太阳光照下的1 M KOH(aq)与1 M KOH(aq)接触时,在水氧化平衡电位下,O2(g)的析出和约28 mA cm ^(-2)的电流密度。这些电极的光电化学性能非常接近中等掺杂n-Si(100)光电电极的Shockley二极管极限,并且可以与包含np +掩埋同质结的典型受保护Si光电阳极相媲美。

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