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Effect of Production Conditions of Wood Powder on Bending Properties of Wood Powder Molding Material without Adhesive

机译：木粉生产条件对无粘性木粉成型材料弯曲性能的影响

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Hiroshi IMANISHI; Naho SOMA; Osamu YAMASHITA; Tsunehisa MIKI; Kozo KANAYAMA;
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年度 2005
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1. Effect of Production Conditions of Wood Powder on Bending Properties of Wood Powder Molding Material without Adhesive [J] . Hiroshi IMANISHI, Naho SOMA, Osamu YAMASHITA, JSME International Journal. Series A, Solid mechanics and material engineering . 2005,第4期

机译：木粉生产条件对无胶木粉成型材料弯曲性能的影响
2. Effect of Production Conditions of Wood Powder on Bending Properties of Wood Powder Molding Material without Adhesive [J] . Hiroshi IMANISHI, Naho SOMA, Osamu YAMASHITA, JSME International Journal. Series A, Solid mechanics and material engineering . 2005,第4期

机译：木粉生产条件对无胶木粉成型材料弯曲性能的影响
3. Material development from wood powder without adhesive by vapor steaming compaction process [J] . Tsunehisa Miki, Kazutoshi Takeuchi, Hiroyuki Sugimoto, Journal of Materials Processing Technology . 2008,第1a3期

机译：通过蒸汽压实工艺从无粘合剂的木粉开发材料
4. MECHANICAL PROPERTY AND FRACTRUE ANALYSIS OF WOOD POWDER/PP COMPOSITE MOLDED BY INJECTION MOLDING [C] . Keisuke Kitai, Tao Zhang, Manabu Nomura Technical Conference of the Society of Plastics Engineers . 2016

机译：注塑成型木粉/ PP复合材料的机械性能和脆带分析
5. Powder processing, powder characterization, and mechanical properties of LAST (lead-antimony-silver-tellurium) and LASTT (lead-antimony-silver-tellurium-tin) thermoelectric materials. [D] . Hall, Bradley Devin. 2008

机译：LAST（铅-锑-银-碲-锡）和LASTT（铅-锑-银-碲-锡）热电材料的粉末加工，粉末表征和机械性能。
6. A Comprehensive Study on The Accelerated Weathering Properties of Polypropylene—Wood Composites with Non-Metallic Materials of Waste-Printed Circuit Board Powders [O] . Shenghui Tian, Yuanfang Luo, Jizun Chen, 2019

机译：废印制线路板粉末非金属材料聚丙烯—木材复合材料加速风化性能的综合研究
7. Wood and Wood Based Materials. Properties of Board Made from Wood Powder with Phenol-Formaldehyde-Powder Resin. [O] . Shigehiko SUZUKI, Masaaki YAMADA 1998

机译：木材和木材基材料。用木粉制成的电路板与酚醛甲醛 - 粉末树脂制成。

Effect of Production Conditions of Wood Powder on Bending Properties of Wood Powder Molding Material without Adhesive

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