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Damage production and annealing in 28Si-implanted CoSi2/Sim(111) heterostructures

机译:植入28Si的CoSi2 / Sim(111)异质结构的损伤产生和退火

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摘要

The damage in epitaxial CoSi2 films 500 nm thick grown on Si(111) produced by room-temperature implantation of 150 keV 28Si were investigated by 2-MeV 4He channeling spectrometry, double-crystal x-ray diffractometry, and electrical resistivity measurements. The damage in the films can be categorized into two types. In lightly (heavily) damaged CoSi2 the damage is in the form of point-like (extended) defects. The resistivity of lightly damaged CoSi2 films rises with the dose of implantation. Electrical defects correlate well with structural ones in lightly damaged films. The resistivity of heavily damaged films flattens off while the structural defects continue to rise with the dose, so that resistivity no longer correlates with structural defects. Upon thermal annealing, lightly damaged films can fully recover structurally and electrically, whereas heavily damaged films do so only electrically. A residual structural damage remains even after annealing at 800 °C for 60 min.
机译:通过2-MeV 4He沟道光谱,双晶X射线衍射和电阻率测量研究了150 keV 28Si室温注入在Si(111)上生长的Si(111)上生长的500 nm厚外延CoSi2膜的损伤。电影中的损坏可分为两种类型。在轻微(严重)损坏的CoSi2中,损坏是以点状(扩展)缺陷的形式出现的。轻度损坏的CoSi2薄膜的电阻率随注入剂量的增加而增加。在轻度损坏的薄膜中,电气缺陷与结构缺陷有很好的关联。严重损坏的薄膜的电阻率趋于平坦,而结构缺陷随剂量而继续升高,因此电阻率不再与结构缺陷相关。在热退火后,轻度损坏的薄膜可以在结构上和电气上完全恢复,而重度损坏的薄膜只能在电气上恢复。即使在800°C退火60分钟后,仍会残留残余的结构损伤。

著录项

  • 作者

    Bai G.; Nicolet M.-A.;

  • 作者单位
  • 年度 1992
  • 总页数
  • 原文格式 PDF
  • 正文语种 {"code":"en","name":"English","id":9}
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