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Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

机译：热循环加载对3D芯片堆叠结构应力 - 应变响应和疲劳寿命的影响

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Liang Zhang; Su-juan Zhong;
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1. Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load [J] . Li Dongbo, Wang Jianpei, Yang Bing, Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe . 2020,第4期

机译：热循环负荷下POP堆叠芯片组件的热性能和疲劳寿命预测
2. EFFECTS OF STRAIN RATIO ON THERMAL-MECHANICAL CYCLIC STRESS-STRAIN RESPONSE AND FATIGUE LIFE IN DS SUPER-ALLOY DZ125 [J] . G. D. Zhang, S.L. Liu, Y.H. He Acta metallurgica Sinica . 2004,第4期

机译：应变比对DS超级合金DZ125热-机械循环应力-应变响应和疲劳寿命的影响
3. Effect of loading path on fatigue degradation and stress-strain response of glass fabric composites under tension/torsion biaxial cyclic loading [J] . Hiroshi Kawakami, Minoru Tamiaki, Toru Fujii 材料 . 1999,第8期

机译：负载路径对拉伸/扭转双轴循环载荷玻璃织物复合材料疲劳降解和应力 - 应变响应的影响
4. EFFECTS OF STRAIN RATIO ON THERMAL-MECHANICAL CYCLIC STRESS-STRAIN RESPONSE AND FATIGUE LIFE IN DS SUPERALLOY DZ125 [C] . Guodong Zhang, Shaolun Liu, Yuhuai He, China-Japan Bilateral Symposium on High Temperature Strength of Materials; 20040816-21; Xi'an(CN) . 2004

机译：应变比对DS超级合金DZ125热-机械循环应力-应变响应和疲劳寿命的影响
5. Random response and fatigue life of aircraft panels subjected to severe acoustic and thermal loads. [D] . Yang, Bo. 2005

机译：飞机面板在严重的声学和热负荷下的随机响应和疲劳寿命。
6. Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests [O] . Chang-Chun Lee 2017

机译：晶圆级底部填充对热循环测试过程中超薄芯片堆叠式3D-IC组件微凸点可靠性的影响
7. Effect of Loading Path on Fatigue Degradation and Stress-Strain Response of Glass Fabric Composites under Tension/Torsion Biaxial Cyclic Loading. [O] . Hiroshi KAWAKAMI, Minoru TAMIAKI, Toru FUJII 1999

机译：负载路径对拉伸/扭转双轴载荷下玻璃织物复合材料疲劳降解和应力 - 应变响应的影响。

Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

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