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Effect of Buffer Layer and III/V Ratio on the Surface Morphology of GaN Grown by MBE

机译:缓冲层和III / V比对MBE生长的GaN表面形貌的影响

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摘要

The surface morphology of GaN is observed by atomic force microscopy for growth on GaN and AlN buffer layers and as a function of III/V flux ratio. Films are grown on sapphire substrates by molecular beam epitaxy using a radio frequency nitrogen plasma source. Growth using GaN buffer layers leads to N-polar films, with surfaces strongly dependent on the flux conditions used. Flat surfaces can be obtained by growing as Ga-rich as possible, although Ga droplets tend to form. Ga-polar films can be grown on AlN buffer layers, with the surface morphology determined by the conditions of buffer layer deposition as well as the III/V ratio for growth of the GaN layer. Near-stoichiometric buffer layer growth conditions appear to support the flattest surfaces in this case. Three defect types are typically observed in GaN films on AlN buffers, including large and small pits and "loop" defects. It is possible to produce surfaces free from large pit defects by growing thicker films under more Ga-rich conditions. In such cases the surface roughness can be reduced to less than 1 nm RMS.
机译:通过原子力显微镜观察GaN的表面形态,以观察其在GaN和AlN缓冲层上的生长以及III / V通量比的函数。使用射频氮等离子体源通过分子束外延在蓝宝石衬底上生长薄膜。使用GaN缓冲层进行生长会形成N极膜,其表面在很大程度上取决于所使用的助焊剂条件。通过生长尽可能多的Ga可以获得平坦的表面,尽管Ga液滴往往会形成。可以在AlN缓冲层上生长Ga极性膜,其表面形态取决于缓冲层沉积的条件以及GaN层生长的III / V比。在这种情况下,接近化学计量的缓冲层生长条件似乎支持最平坦的表面。通常在AlN缓冲层上的GaN膜中观察到三种缺陷类型,包括大和小凹坑和“环形”缺陷。通过在更富Ga的条件下生长较厚的薄膜,可以生产出无大坑缺陷的表面。在这种情况下,表面粗糙度可以减小到小于1 nm RMS。

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