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DC and millimeter-wave performance of watt-level barrier-intrinsic-n+ diode-grid frequency multiplier fabricated on III-V compound semiconductors

机译:在III-V型化合物半导体上制造的瓦特级势垒本征n +二极管栅倍频器的直流和毫米波性能

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摘要

This paper reports the fabrication and millimeter-wave performance of a new class of monolithic metal-semiconductor heterostructure devices, the Barrier- Intrinsic-N+ (BIN) diode-grid frequency multipliers, which are fabricated on III-V compound semiconductors. This work also involves the measurement of the DC and low frequencyudelectrical properties of the BIN diode-grid frequency multiplier. In addition, a new analytical model which accurately describes the structure has been developed and is presented for the first time.
机译:本文报道了在III-V族化合物半导体上制造的新型单片金属-半导体异质结构器件-势垒-本征-N +(BIN)二极管-网格倍频器的制造和毫米波性能。这项工作还涉及BIN二极管电网倍频器的直流和低频电气特性的测量。此外,已经开发并首次提出了一种能够准确描述结构的新分析模型。

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