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Activation analysis of rapid thermally annealed Si and Mg implanted semi-insulating GaAs

机译:快速热退火注入硅和镁的半绝缘GaAs的活化分析

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摘要

Electronic properties of Si and Mg implants in undoped semi-insulating GaAs are studied. The activation of the implants is achieved by rapid thermal annealing. The effects of implantation dose and anneal temperature on the measured electrical activity are investigated. In spite of similar depth distributions and implantation damage characteristics, a marked difference between the activations of the Si and the Mg ions is observed for the dose range considered (3×10^12 – 1×10^14 cm^–2). Lattice strain measurements performed by x-ray rocking curves indicate that the residual implantation damage after annealing is not largely responsible for this difference. The difference is mostly electronic in character, as also suggested by photoluminescence measurements. At high annealing temperatures, changes in the compensating properties of undoped semi-insulating GaAs are suspected, and are found to play an important role in the activation of implanted ions, affecting the n- and p-type dopants conversely.
机译:研究了非掺杂半绝缘GaAs中Si和Mg注入的电子性能。植入物的激活是通过快速热退火实现的。研究了注入剂量和退火温度对测得的电活性的影响。尽管深度分布和注入损伤特性相似,但在所考虑的剂量范围(3×10 ^ 12 – 1×10 ^ 14 cm ^ –2)上,Si和Mg离子的活化之间存在明显差异。通过X射线摇摆曲线进行的晶格应变测量表明,退火后残留的注入损伤不是造成这种差异的主要原因。这种差异主要是电子性质的,正如光致发光测量所表明的那样。在较高的退火温度下,怀疑未掺杂的半绝缘GaAs的补偿特性会发生变化,并发现它们在注入离子的活化中起着重要作用,反过来会影响n型和p型掺杂剂。

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