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Integrated movable micromechanical structures for sensors and actuators

机译:用于传感器和执行器的集成可移动微机械结构

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摘要

Movable pin-joints, gears, springs, cranks, and slider structures with dimensions measured in micrometers have been fabricated using silicon microfabrication technology. These micromechanical structures, which have important transducer applications, are batch-fabricated with an IC-compatible process. The movable mechanical elements are built on layers that are later removed so that they are freed for translation and rotation. An undercut-and-refill technique, which makes use of the high surface mobility of silicon atoms undergoing chemical vapor deposition, is used to refill undercut regions in order to form restraining flanges. Typical element sizes and masses are measured in micrometers and nanograms. The process provides the tiny structures in an assembled form avoiding the nearly impossible challenge of handling such small elements individually.
机译:使用硅微细加工技术已经制造出尺寸以微米为单位的活动销接头,齿轮,弹簧,曲柄和滑块结构。这些具有重要换能器应用的微机械结构是通过与IC兼容的工艺批量制造的。可移动的机械元件构建在随后被移除的层上,以便将它们释放以进行平移和旋转。利用利用进行化学气相沉积的硅原子的高表面迁移率的底切和再填充技术来再填充底切区域,以形成约束凸缘。典型的元素尺寸和质量以微米和纳克为单位。该过程以组装的形式提供了微小的结构,从而避免了单独处理这样的小元件几乎是不可能的挑战。

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