首页> 外文OA文献 >Pengaruh Temperatur Tuang, Temperatur Cetakan, dan Tekanan Pada Pengecoran Bertekanan (High Pressure Die Casting/HPDC) Terhadap Kekerasan dan Struktur Mikro Aluminium Paduan Silikon (Al-Si 7,79 )
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Pengaruh Temperatur Tuang, Temperatur Cetakan, dan Tekanan Pada Pengecoran Bertekanan (High Pressure Die Casting/HPDC) Terhadap Kekerasan dan Struktur Mikro Aluminium Paduan Silikon (Al-Si 7,79 )

机译:浇注温度,温度模具和压力对压力铸造(高压压铸/ HPDC)对暴力和微结构铝合金硅胶(Al-Si 7.79%)

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摘要

The purposes of this research are to investigate the effect of mold temperature, melting temperatur, and pressure on micro structure and hardness. The alloy used is Al-Si 7,79% using the High Pressure Die Casting (HPDC) method.HPDC is a casting method with injection the metal liquid to the cavity mold with specific speed and pressure. This research used 3 variations, they are pressure (50 bar, 75 bar, and 100 bar), melt temperature (700°C, 750 °C, and 800°C), and molding temperature (250°C, 300°C, and 350°C).Observations were made on the microstructure of the alloys show that Al-Si 7.79% showed some similar changed which is the tendency of the silicon phase will become thick silicon chip and the primary is likely to change even greater. This condition is caused by an increase in time solidification with increasing melt temperature and the mold temperature. The hardness in general will increase with increasing temperature and pressure. The highest hardness is 79,94 BHN at mold temperature of 250 °C, melt temperature of 750 ° C and pressure of 75 bar.
机译:该研究的目的是探讨模具温度,熔化温度和压力对微结构和硬度的影响。使用的合金是使用高压压铸(HPDC)方法的Al-Si 7,79%.HPDC是一种具有特定速度和压力的空腔模具的金属液体的铸造方法。本研究使用了3个变型,它们是压力(50巴,75巴和100巴),熔体温度(700°C,750°C和800°C),和模塑温度(250°C,300°C,和350℃)。在合金的微观结构上制备了350℃,表明Al-Si 7.79%显示了一些类似的改变,这是硅相的趋势将变厚硅芯片,主要可能会改变厚度。这种情况是由于随着熔体温度和模具温度的增加而增加而导致的时间凝固。硬度通常会随着温度和压力的增加而增加。最高硬度为250℃,熔体温度为750°C的熔体温度和75巴的压力,最高硬度为79,94bhn。

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