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Aging Effect on Adhesion Strength between Electroless Copper and Polyimide Films

机译：无电镀铜与聚酰亚胺薄膜粘合强度的老化影响

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Ho-Nyun Lee; Yoonsung Han; Jang-hun Lee; Jin-Young Hur; Hong Kee Lee;
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1. Aging Effect on Adhesion Strength between Electroless Copper and Polyimide Films [J] . Ho-Nyun Lee, Yoonsung Han, Jang-hun Lee Materials transactions . 2013,第6期

机译：时效对化学镀铜与聚酰亚胺薄膜之间粘合强度的影响
2. Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage [J] . Zenglin Wang, Akihiko Furuya, Keiichirou Yasuda, Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology . 2002,第8期

机译：通过结合表面微粗糙化和酰亚胺环断裂，提高化学镀铜对聚酰亚胺薄膜基材的附着力
3. Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer (vol 25, pg 117, 2019) [J] . Koo Seok-Bon, Lee Chang-Myeon, Kwon Sang-Jun, Metals and Materials International . 2019,第3期

机译：聚酰亚胺膜和铜层粘合强度的老化效应研究（Vol 25，PG 117,2019）
4. A Study of Interfacial Layer Effect Synthesized by High Energy Ion Cascade on Adhesion Strength Deterioration Between Copper Thin Film and Polyimide Substrates [C] . Y.M. Chung, W.S. Jung, C.S. Moon, Society of Vacuum Coaters Annual Technical Conference; 20050423-28; Denver,CO(US) . 2005

机译：高能离子流合成界面层效应对铜薄膜与聚酰亚胺基体粘结强度下降的影响
5. Enhanced adhesion between electroless copper and advanced substrates [D] . Hayden, Harley T. 2008

机译：增强化学镀铜与高级基材之间的附着力
6. Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates [O] . Yao-yao Tan, Yan Zhang, Gang-lan Jiang, 2020

机译：热膨胀系数极低的固有黑色聚酰亚胺薄膜的制备和性能及其在黑色柔性覆铜箔层压板中的潜在应用
7. Correction to: Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer [O] . Seok-Bon Koo, Chang-Myeon Lee, Sang-Jun Kwon, 2019

机译：校正：聚酰亚胺膜和铜层粘合强度老化效应的研究
8. Adhesion Enhancement of Thin Copper Film on Polyimide Modified by Oxygen ReactiveIon Beam Etching [R] . Paik, K. W., Ruoff, A. L. 1990

机译：添加到阅览室阅读软件下载与<<氧反应离子束蚀刻改性聚酰亚胺薄膜的增粘作用>>相似的文献

Aging Effect on Adhesion Strength between Electroless Copper and Polyimide Films

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