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Nanoscale patterning by AFM lithography and its applicationudon the fabrication of silicon nanowire devices

机译:原子力显微镜光刻纳米图形化及其应用 ud硅纳米线器件的制造

摘要

Many techniques have been applied to fabricate nanostructures via top-down approach such as electron beam lithography. However, most of the techniques are very complicated and involves many process steps, high cost operation as well as the use of hazardous chemicals. Meanwhile, atomic force microscopy (AFM) lithography is a simple technique which is considered maskless and involves only an average cost and less complexity. In AFM lithography, the movement of a probe tip can be controlled to create nanoscale patterns on sample surface. For silicon nanowire (SiNW) fabrication, a conductive tip was operated in non-contact AFM mode to grow nanoscale oxide patterns on silicon-on-insulator (SOI) wafer surface based on local anodic oxidation (LAO) mechanism. The patterned structure was etched through two steps of wet etching processes. First, the TMAH was used as the etchant solution for Si removing. In the second step, diluted HF was used to remove oxide mask in order to produce a completed SiNW based devices. A SiNW based device which is formed by a nanowire channel, source and drain pads with lateral gate structures can be fabricated by well controlling the lithography process (applied tip voltage and writing speed) as well as the etching processes.
机译:通过自上而下的方法,例如电子束光刻,已经应用了许多技术来制造纳米结构。但是,大多数技术非常复杂,涉及许多工艺步骤,高成本操作以及有害化学物质的使用。同时,原子力显微镜(AFM)光刻技术是一种简单的技术,被认为是无掩膜的,仅涉及平均成本,且复杂度较低。在AFM光刻中,可以控制探针尖端的移动以在样品表面上创建纳米级图案。对于硅纳米线(SiNW)制作,基于局部阳极氧化(LAO)机理,以非接触AFM模式操作导电尖端,以在绝缘体上硅(SOI)晶片表面上生长纳米级氧化物图案。通过两步湿法蚀刻工艺来蚀刻图案化的结构。首先,将TMAH用作去除Si的蚀刻剂溶液。在第二步中,使用稀释的HF去除氧化物掩模,以生产出完整的基于SiNW的器件。可以通过很好地控制光刻过程(施加的尖端电压和写入速度)以及蚀刻过程,来制造由具有横向栅极结构的纳米线沟道,源极和漏极焊盘形成的基于SiNW的器件。

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