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Characterization of Patterned Porous Low-kDielectrics: Surface Sealing and Residue Removal by Wet Processing/Cleaning

机译：图案化多孔低kdiEtrics的表征：湿法加工/清洁表面密封和残留物去除

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Q. T. Le; E. Kesters; S. Decoster; B. T. Chan; M. P. Nguyen; T. Conard; A. Vanleenhove; F. Holsteyns; S. De Gendt;
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年度 2016
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1. Characterization of Patterned Porous Low-k Dielectrics: Surface Sealing and Residue Removal by Wet Processing/Cleaning [J] . Le Q. T., Kesters E., Decoster S., ECS Journal of Solid State Science and Technology . 2016,第3期

机译：图案化多孔低k电介质的特性：通过湿法加工/清洁进行表面密封和去除残留物
2. POROUS LOW-K WET ETCH IN HF-BASED SOLUTIONS :FOCUS ON CLEANING PROCESS WINDOW, "PORE-SEALING" AND "K RECOVERY" [J] . L. Broussous, W. Puyrenier, D. Rebiscoul, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2009,第Null期

机译：基于HF的解决方案中的多孔低K湿蚀刻：关注清洁过程窗口，“孔密封”和“ K恢复”
3. POROUS LOW-K WET ETCH IN HF-BASED SOLUTIONS : Focus ON CLEANING PROCESS WINDOW, "PORE-SEALING" AND "K RECOVERY" [J] . L. Broussous, W. Puyrenier, D. Rebiscoulb, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2009,第0期

机译：基于HF的解决方案中的多孔低K湿蚀刻：着重于清洁过程窗口，“孔密封”和“ K恢复”
4. Surfactants as an Additive to Wet Cleaning Solutions for Plasma Etch Residue Removal: Compatibility to a Porous CVD-SiCOH Ultra Low-k Dielectric Material [C] . N. Ahner, S.E. Schulz, M. Zacher Cleaning and surface conditioning technology in semiconductor device manufacturing 11 . 2009

机译：表面活性剂作为等离子去除残留湿法清洁解决方案的添加剂：与多孔CVD-SiCOH超低k介电材料的兼容性
5. The manipulation and characterization of patterned surfaces: I. Oriented nanoscale porous materials II. Drop mobility on surfaces with patterned wettability. [D] . Kim, Bokyung. 2010

机译：图案化表面的处理和特征：I.取向的纳米级多孔材料II。滴在具有图案化润湿性的表面上流动。
6. Efficacy of low-pressure foam cleaning compared to conventional cleaning methods in the removal of bacteria from surfaces associated with convenience food [O] . AA Lambrechts, IS Human, JH Doughari, 2014

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7. Cu surface characterization after wet cleaning processes [O] . Alessandri M 2015

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8. Multiprocess Wet Cleaning: Cost and Performance Comparison of Conventional Dry Cleaning and an Alternative Process [R] . Jehassi, O. 1993

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Characterization of Patterned Porous Low-kDielectrics: Surface Sealing and Residue Removal by Wet Processing/Cleaning

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