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Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters—A Review

机译:通过热敏电气参数测量功率半导体器件的温度测量 - 评论

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摘要

This paper proposes a synthesis of different electrical methods used to estimate the temperature of power semiconductor devices. The following measurement methods are introduced: the voltage under low current levels, the threshold voltage, the voltage under high current levels, the gate-emitter voltage, the saturation current, and the switching times. All these methods are then compared in terms of sensitivity, linearity, accuracy, genericity, calibration needs, and possibility of characterizing the thermal impedance or the temperature during the operation of the converter. The measurement of thermo-sensitive parameters of wide bandgap semiconductors is also discussed.
机译:本文提出了用于估计功率半导体器件温度的不同电气方法的合成。介绍以下测量方法:低电流水平下的电压,阈值电压,高电流水平下的电压,栅极 - 发射极电压,饱和电流和切换时间。然后在灵敏度,线性,精度,常见性,校准需求和表征转换器操作期间的热阻抗或温度方面进行比较所有这些方法。还讨论了宽带隙半导体的热敏参数的测量。

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