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Cure-induced residual stresses for warpage reduction in thermoset laminates

机译：固化翘曲的热固性层压材料翘曲的残余应力

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Giacomo Struzziero; Davide Nardi; Jos Sinke; J J E Teuwen;
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年度 2020
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1. Cure-induced residual stresses for warpage reduction in thermoset laminates [J] . Struzziero Giacomo, Nardi Davide, Sinke Jos, Journal of Composite Materials . 2020,第22期

机译：固化型翘曲的翘曲致敏感胁迫降低热固性层压板
2. Study on cure-induced residual stresses and spring-in deformation of L-shaped composite laminates using a simplified constitutive model considering stress relaxation [J] . Liu Xiaodong, Guan Zhidong, Wang Xiaodong, Composite Structures . 2021,第Sepa期

机译：考虑压力松弛的简化本构模型，Cure诱导的残余应力和L形复合层压板的弹簧变形
3. Study on Cure-Induced Residual Stresses for Fibre Metal Laminate [J] . Yue Guangquan, Zhang Jiazhen, Meng Songhe Polymers & Polymer Composites . 2013,第9期

机译：金属纤维层压板的固化诱导残余应力研究
4. Analytical estimate for cure-induced stresses and warpage in flat packages [C] . Jansen K.M.B., de Vreugd J., Ernst L.J. 2011 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems . 2011

机译：扁平包装中固化引起的应力和翘曲的分析估计
5. Viscoelastic constitutive models for evaluation of residual stresses in thermoset composites during cure. [D] . Zobeiry, Nima. 2006

机译：用于评估固化期间热固性复合材料中残余应力的粘弹性本构模型。
6. An Improved Analytical Solution for Process-Induced Residual Stresses and Deformations in Flat Composite Laminates Considering Thermo-Viscoelastic Effects [O] . Chao Liu, Yaoyao Shi 2018

机译：考虑热粘弹性效应的平面复合材料层板过程中残余应力和变形的改进解析解
7. A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer [O] . Seyed Amir Fouad Farshchi Yazdi, Matteo Garavaglia, Aldo Ghisi, 2021

机译：粘合晶圆中翘曲和减少翘曲和残余应力的新方法
8. Development of Techniques for Controlling Warpage and Residual Stresses in Welded Structures [R] . 1969

机译：焊接结构翘曲和残余应力控制技术的发展

Cure-induced residual stresses for warpage reduction in thermoset laminates

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