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CONTAMINATION OF POTABLE WATER BY CORROSION OF TIN-LEAD SOLDERED JOINTS

机译：通过锡铅焊接接头腐蚀渗透饮用水

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Robert Walker; Roger J. Oliphant;
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年度 1989
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1. Forming Solder Joints by Sintering Eutectic Tin-Lead Solder Paste [J] . MK A. PALMER, CHRISTY N. ALENDER, BRIAN NGUYEN Journal of Electronic Materials . 1999,第7期

机译：通过烧结共晶锡铅锡膏形成焊点
2. Nitrate accelerated corrosion of lead solder in potable water systems [J] . Caroline K. Nguyen, Kendall R. Stone, Marc A. Edwards Corrosion science . 2011,第3期

机译：硝酸盐对饮用水系统中铅焊料的加速腐蚀
3. A new scenario of lead contamination in potable water distribution systems: Galvanic corrosion between lead and stainless steel [J] . Ding-Quan Ng, Che-Yu Chen, Yi-Pin Lin The Science of the Total Environment . 2018,第OCTa1期

机译：饮用水分配系统中铅污染的新情况：铅与不锈钢之间的电偶腐蚀
4. CREEP FRACTURE BEHAVIOUR OF JOINTS SOLDERED BY A NANO-COMPOSITE SOLDER, LEAD-FREE AND CONVENTIONAL TIN-LEAD SOLDERS [C] . X. P. Zhang, Y. W. Shi, Y. W. Mai, International Conference on Fracture . 2005

机译：纳米复合焊料，无铅和常规锡铅焊接焊接接头的蠕变断裂行为
5. The effect of noble metal contamination on the mechanical properties of eutectic tin-lead solder joints. [D] . Pratt, Ronald E. 1994

机译：贵金属污染对共晶锡铅焊点机械性能的影响。
6. Cuprous Oxide-or Copper-Coated Jute Stick Piecesat an Air–Water Interfacefor Prevention of Aerial Contamination in Potable Water [O] . Randhir Rai, Sathyanarayana N. Gummadi, Dillip Kumar Chand 2019

机译：氧化亚铜或铜涂层黄麻棒件在空气-水界面处预防饮用水中的空气污染
7. Corrosion characterization of tin-lead and lead free solders in 3.5 wt. NaCl solution [O] . Li Dezhi, Conway Paul P., Liu Changqing 2008

机译：锡铅和无铅焊料在3.5 wt。％NaCl溶液中的腐蚀特性
8. Nature and Growth Kinetics of the Diffusion Layer of Copper Joints Soldered by Tin-Lead Solders [R] . Il'evskii, I. I. 1980

机译：锡铅焊料焊接铜接头扩散层的性质和生长动力学

CONTAMINATION OF POTABLE WATER BY CORROSION OF TIN-LEAD SOLDERED JOINTS

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