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Numerical Modeling and Analysis of Microbump Pitch Effect in 3D IC Package with TSV During Molded Underfill (MUF)

机译：用模制底填充物（MUF）三维IC封装Microbump音调效应的数值建模与分析（MUF）

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Ernest E.S. Ong; M.Z. Abdullah; C.Y. Khor; W.C. Leong; W.K. Loh; C.K. Ooi; R. Chan;
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年度 2013
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1. Numerical Modeling and Analysis of Microbump Pitch Effect in 3D IC Package with TSV During Molded Underfill (MUF) [J] . Ernest E.S. Ong, M.Z. Abdullah, C.Y. Khor, Engineering Applications of Computational Fluid Mechanics . 2013,第2期

机译：带模制底部填充（MUF）的带TSV的3D IC封装中微凸点间距效应的数值建模和分析
2. Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis [J] . Yoon Hyungseok, Choi Kwang-Seong, Bae Hyun-Cheol, Microelectronics & Reliability . 2017,第APRa期

机译：使用数值分析评估可靠的3D TSV集成封装的底部填充材料的性能
3. Numerical Analysis On Thermal Characteristics For Chip Scale Package By Integrating 2d/3d Models [J] . Ping Yang, Wei Li International journal of numerical modelling . 2009,第1期

机译：集成2d / 3d模型的芯片级封装热特性数值分析
4. Molded Underfill (MUF) Encapsulation for Flip-Chip Package: A Numerical Investigation [C] . M.A. Azmi, M.K. Abdullah, M.Z. Abdullah, International Conference of Global Network for Innovative Technology . 2017

机译：倒装芯片封装的模压底填充（MUF）封装：数值调查
5. Compact modeling methodology development for thermomechanical assessment in high-end mobile applications – Planar and 3D TSV packages [D] . Mirza, Fahad 2014

机译：紧凑的建模方法开发，用于高端移动应用中的热机械评估–平面和3D TSV封装
6. Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests [O] . Chang-Chun Lee 2017

机译：晶圆级底部填充对热循环测试过程中超薄芯片堆叠式3D-IC组件微凸点可靠性的影响
7. Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests [O] . Chang-Chun Lee 2017

机译：晶圆级底部填充对热循环试验中超薄芯片堆叠式3D-IC组件微型泵可靠性的影响

Numerical Modeling and Analysis of Microbump Pitch Effect in 3D IC Package with TSV During Molded Underfill (MUF)

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