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Formation Mechanisms of Thermal Fatigue Crack Networks in Sn-Ag-Cu Die-attach Joint in High Speed Thermal Cycling

机译：高速热循环中Sn-Ag-Cu模具连接接头中热疲劳裂缝网络的形成机制

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Hiroshige SUGIMOTO; Yoshiharu KARIYA; Yoshiki ABE; Ryuichiro HANADA; Yoshinori YOKOYAMA; Shinnosuke SODA;
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2. Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude Temperature Swings Based on 3D Electro-Thermal-Mechanical FE Simulations [J] . Yongle Huang, Hongfei Deng, Yifei Luo, Industrial Electronics, IEEE Transactions on . 2021,第4期

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4. Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents [C] . Kang S.K., Lauro P., Da-Yuan Shih, . -1

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5. Towards an understanding of thermal cycling effects on lead free solder joint deformation mechanisms. [D] . Alghoul, Thaer M. 2015

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6. Correlation between Thermal Behaviour of AA5754-H111 during Fatigue Loading and Fatigue Strength at Fixed Number of Cycles [O] . Rosa De Finis, Davide Palumbo, Livia Maria Serio, 2018

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7. A probabilistic model to predict the formation and propagation of crack networks in thermal fatigue [O] . Malesys, Nicolas, Vincent, Ludovic, Hild, François 2009

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8. Investigation of Thermal High Cycle and Low Cycle Fatigue Mechanisms of Thick Thermal Barrier Coatings [R] . Zhu, D. , Miller, R. A. 1998

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Formation Mechanisms of Thermal Fatigue Crack Networks in Sn-Ag-Cu Die-attach Joint in High Speed Thermal Cycling

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