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Development of MSP5, a High Strength and High Electrical Conductive Solid-solution Copper alloy for Automotive Terminal

机译：开发MSP5，高强度和高导电固溶铜合金，用于汽车终端

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Yuki Ito; Kazunari Maki; Takanori Kobayashi; Shinya Koike;
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年度 2016
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Development of MSP5, a High Strength and High Electrical Conductive Solid-solution Copper alloy for Automotive Terminal

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