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Analysis and Measurement of Chip Current Imbalance Caused by the Difference of Impedance of Each Parallel Circuit in a Power Module

机译：功率模块中每个并联电路阻抗差异引起的芯片电流不平衡的分析和测量

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Takeshi Ohi; Tatsuya Okuda; Hirotaka Muto; Toshiyuki Kikunaga; Hideo Matsumoto;
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年度 2001
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1. A Hot-Swap Solution for Paralleled Power Modules by Using Current-Sharing Interface Circuits [J] . Yi Chen, Cheng D. K.-W., Yim-Shu Lee IEEE Transactions on Power Electronics . 2006,第期

机译：使用电流共享接口电路的并联电源模块热插拔解决方案
2. A Hot-Swap Solution for Paralleled Power Modules by Using Current-Sharing Interface Circuits [J] . Yi Chen, Cheng D.K.-W., Yim-Shu Lee IEEE Transactions on Power Electronics . 2006,第6期

机译：使用电流共享接口电路的并联电源模块热插拔解决方案
3. Impact of stray-inductance imbalance on short-circuit capability of multi-chip SiC power modules [J] . Chou K., Isobe T., Mannen T. Microelectronics & Reliability . 2020,第Nova期

机译：杂散电感不平衡对多芯片SIC电源模块短路能力的影响
4. Analysis and measurement of chip current imbalances caused by the structure of bus bars in an IGBT module [C] . Ohi, T., Horiguchi, Industry Applications Conference, 1999. Thirty-Fourth IAS Annual Meeting. Conference Record of the 1999 IEEE . 1999

机译：IGBT模块中的母线结构引起的芯片电流不平衡的分析和测量
5. On -chip current and power measurement techniques for integrated circuits with regulated power [D] . Chen, Chuen-Song 2008

机译：具有稳压功率的集成电路的片上电流和功率测量技术
6. Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining [O] . Dongjin Kim, Yasuyuki Yamamoto, Shijo Nagao, 2019

机译：SiC微型加热器芯片系统和Ag烧结连接法测量各种陶瓷DBC基板上功率模块的散热和热稳定性
7. Asynchronous Gate Signal Driving Method for Reducing Current Imbalance of Paralleled IGBT Modules Caused by Driving Circuit Parameter Difference [O] . Xianjin Huang, Feng Mu, Yixin Liu, 2021

机译：异步栅极信号驱动方法，用于减少通过驱动电路参数差引起的并联IGBT模块的电流不平衡
8. Analysis and measurement of thermal resistance in a 3-dimensional silicon multichip module populated with assembly test chips [R] . Sweet, J N, Peterson, D W, Chu, D, 1992

机译：用组装测试芯片填充的三维硅多芯片模块中的热阻分析和测量

Analysis and Measurement of Chip Current Imbalance Caused by the Difference of Impedance of Each Parallel Circuit in a Power Module

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