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Fabrication of Micro-Patterned Surface for Pool-boiling Enhancement by Using Powder Injection Molding Process

机译:通过使用粉末注射成型工艺制备微图案化的池沸腾增强

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摘要

In this study, two kinds of copper micro-patterned surfaces with different heights were fabricated by using a powder injection molding (PIM) process. The micro-pattern’s size was 100 μm, and the gap size was 50 μm. The short micro-pattern’s height was 100 μm, and the height of the tall one was 380 μm. A copper powder and wax-polymer-based binder system was used to fabricate the micro-patterned surfaces. The critical heat flux (CHF) and heat transfer coefficient (HTC) during pool-boiling tests were measured with the micro-patterned surfaces and a reference plain copper surface. The CHF of short and tall micro-patterned surfaces were 1434 and 1444 kW/m2, respectively, and the plain copper surface’s CHF was 1191 kW/m2. The HTC of the plain copper surface and the PIM surface with short and tall micro-patterned surfaces were similar in value up to a heat flux 1000 kW/m2. Beyond that value, the plain surface quickly reached its CHF, while the HTC of the short micro-patterned surface achieved higher values than that of the tall micro-patterned surface. At CHF, the maximum values of HTC for the short micro-pattern, tall micro-pattern, and the plain copper surface were 68, 58, and 57 kW/m2 K.
机译:在该研究中,通过使用粉末注射成型(PIM)工艺制造两种具有不同高度的微图案化表面。微图案的尺寸为100μm,间隙尺寸为50μm。短的微图案的高度为100μm,高的高度为380μm。铜粉和蜡聚合物基粘合剂体系用于制造微图案化表面。用微图案化表面和参考普通铜表面测量池沸腾试验期间的临界热通量(CHF)和传热系数(HTC)。短而高的微观图案化表面的CHF分别为1434和1444 kW / m2,普通铜表面的CHF为1191 kW / m 2。普通铜表面的HTC和带有短的微图案表面的PIM表面,值为高达热通量1000kW / m2。超出该值,平面表面快速达到了其CHF,而短的微图案表面的HTC的HTC达到高于高层微图案表面的值。在CHF时,HTC为短微观图案,高度微观图案和普通铜表面的最大值为68,58和57 kW / m2 k。

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