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Evaluation of Cutting Forces for Intermetallic Compounds Formed on Solder Joint Interface by Instrumented Ultramicrotome

机译：用仪表超微摩托大麦焊接接口形成金属间化合物的切割力评价

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Chiko Yorita; Yuko Imamura; Yasuhisa Hirohata; Kentaro Asakura;
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年度 2004
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2. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints [J] . Lingyun Zhang, Shengquan Ou, Joanne Huang, Applied Physics Letters . 2006,第1期

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3. Formation and evolution of intermetallic compounds at interfaces of Cu/Al joints by ultrasonic-assisted soldering [J] . Zhang Huiwen, Cui Wei, He Jingshan, Journal of Materials Processing Technology . 2015,第Null期

机译：超声辅助焊接在Cu / Al接头界面形成金属间化合物
4. Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag Cu solder on a Cu Pad [J] . Hiroshi Nishikawa, Noriya Iwata Journal of Materials Processing Technology . 2015,第Null期

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5. Effect of isothermal aging on the growth and morphology of the intermetallic compounds formed at the Solder/Cu interface of the lead -free solder joint [C] . FU Yun, ZHANG Qi, SUN Feng, Pacific Rim International Conference on Advanced Materials and Processing; 20071105-09; Jeju Island(KR) . 2007

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6. Effect of Thermo-Electromigration on Copper Dissolution and Intermetallic Compound Formation in Flip-Chip Lead-free Solder Joints [D] . Han, Jung Kyu 2011

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7. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions [O] . Ai Ting Tan, Ai Wen Tan, Farazila Yusof 2015

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8. Study of intermetallic compound layer formation, growth and evaluation of shear strength of lead-free solder joints [O] . Bernasko Peter Kojo 2012

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9. Formation of Intermetallic Compounds in Solder Joints and Its Effects on Joint Reliability. [R] . Zeng, K., Peng, W., Kivilahti, J. 2001

机译：焊点中金属间化合物的形成及其对接头可靠性的影响。

Evaluation of Cutting Forces for Intermetallic Compounds Formed on Solder Joint Interface by Instrumented Ultramicrotome

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