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The Effect of Residual Stress on Vacancy Transportation in Cu Interconnection due to Electromigration

机译：剩余应力对电迁移时Cu互连空位运输的影响

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Tutomu Murakawa; A. Toshimitsu Yokobori; Takenao Nemoto; Hideo Miura;
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年度 2006
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1. Numerical Analysis of Vacancy Transport by Residual Stress in Electromigration on LSI Interconnects [J] . Takenao Nemoto, Toshimitsu A. Yokobori Jr., Tsutomu Murakawa, Japanese journal of applied physics . 2010,第2issue1期

机译：LSI互连线上电迁移中残余应力对空位传输的数值分析
2. Effects of Surface Cleaning on Stressvoiding and Electromigration of Cu-Damascene Interconnection [J] . Wang J.-P., Su Y.-K., Chen J. F. IEEE transactions on device and materials reliability . 2008,第1期

机译：表面清洁对铜大马士革互连件的应力消除和电迁移的影响
3. Fabrication and characterization of Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration [J] . Xiao Ming, Munief Walid Madhat, Wu Fengshun, Soldering & Surface Mount Technology . 2016,第2期

机译：用于3D集成中电迁移研究的Cu-Sn-Ni-Cu互连微结构的制备和表征
4. Electromigration and stress-induced-voiding in dual damascene Cu/low-k interconnects: a complex balance between vacancy and stress gradients [C] . Croes K., Wilson C.J., Lofrano M., IEEE International Reliability Physics Symposium . 2010

机译：双镶嵌铜/低k互连中的电迁移和应力诱导的空隙：空位和应力梯度之间的复杂平衡
5. Investigation of the effect of current singularity on vacancy concentration in 2D coupled electromigration. [D] . Taner, Ozgur. 2014

机译：研究电流奇异性对二维耦合电迁移中空位浓度的影响。
6. Analysis of Deformation Behaviour and Residual Stress in Rotary Swaged Cu/Al Clad Composite Wires [O] . Lenka Kunčická, Adéla Macháčková, Ludmila Krátká, 2019

机译：模锻铜/铝复合丝的变形行为和残余应力分析
7. Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction [O] . Kai Chen, N. Tamura, B. C. Valek, 2008

机译：通过电迁移胁迫的Al（Cu）互连中的塑性变形，并通过同步旋转多色X射线Microdiffraction研究

The Effect of Residual Stress on Vacancy Transportation in Cu Interconnection due to Electromigration

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