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A High-Signal-Integrity PCB Trace Composed of Multiple Segments for GHz VLSI Packaging: Its Prototyping and Performance Analysis

机译：由GHz VLSI包装的多个段组成的高信号完整性PCB迹线：其原型和性能分析

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Moritoshi Yasunaga; Hiroki Shimada; Shohei Akita; Masami Ishiguro; Ikuo Yoshihara;
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年度 2011
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1. Suppression of GHz range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in multilayer packages and PCBs [J] . Hyungsoo Kim, Byung Kook Sun, Joungho Kim IEEE microwave and wireless components letters . 2004,第2期

机译：使用多层封装和PCB中的嵌入式薄膜电容器来抑制GHz范围的电源/地感应阻抗并同时产生开关噪声
2. EMI Across Randomly-Patterned Multiple Traces on a PCB of an Audio/Multimedia Infrastructure: Crosstalk Performance Vis-a-Vis Smart Handheld Devices [J] . PERAMBUR S. NEELAKANTA, AZIZ U. NOORI Interference Technology: EMC Directory & Design Guide . 2015,第Null期

机译：跨音频/多媒体基础设施PCB上的随机图案多条走线的EMI：串扰性能Vis-a-Vis智能手持设备
3. Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications [J] . Canavero F., Franzon P. D. IEEE Transactions on Advanced Packaging . 2008,第4期

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4. Prototyping of A Novel PCB-Trace Composed of Multiple Segments and Its Signal-Integrity Evaluation [C] . Moritoshi Yasunaga, Hiroshi Nakayama, Youki Shimauchi, 11th international conference on electronic materials and packaging 2009 . 2009

机译：一种由多段组成的新型PCB轨迹的原型及其信号完整性评估
5. Integral equation methodologies for the signal integrity analysis of PCB and interconnect structures in layered media from DC to multi-GHz frequencies. [D] . Morsey, Jason David. 2003

机译：积分方程方法用于从DC到Multi-GHz频率的分层介质中PCB和互连结构的信号完整性分析。
6. A novel approach to non-segmented flow analysis. Part 2. A prototype high-performance analyser [O] . D. J. Malcolme-Lawes, C. Pasquini 1988

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A High-Signal-Integrity PCB Trace Composed of Multiple Segments for GHz VLSI Packaging: Its Prototyping and Performance Analysis

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