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Wax-bonding 3D microfluidic chips

机译:蜡粘接3D微流体芯片

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摘要

We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.
机译:我们报告一个简单的,低成本的和可拆卸的微流控芯片掺入方便纸,玻璃载玻片或其它聚合物膜与粘合剂蜡作为回收接合材料沿所述芯片的材料。我们使用激光来切割通过纸或膜,以形成图案,然后夹着玻璃板或聚合物膜之间的纸和薄膜。热熔粘合剂的蜡可以实现各种材料之间桥键合,例如,纸,聚甲基丙烯酸甲酯膜,玻璃板,或金属板。结合过程是可逆的,并且该蜡通过熔化和冷却过程是可重复使用。通过该处理,三维(3D)微流体芯片是由vacuating和放空在热水浴芯片实现的。为了研究蜡基微流体芯片的生物相容性和适用性,我们测试与芯片材料的第一PCR的相容性。然后,我们应用了基于蜡光纸微流体芯片到HeLa细胞电穿孔(EP)。随后,有5层3D芯片的原型是由多层蜡粘接制造。要检查的密封能力和芯片的耐久性,绿色荧光蛋白(GFP)的重组大肠杆菌(大肠杆菌)的细菌进行培养,与大肠杆菌的趋化作用是为了研究以确定抗生素环丙沙星浓度的影响在大肠杆菌(E.coli)的迁移。

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