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Studies on Brazability of Electric Contact Chip Materials (Report I) : Effect of Surface Preparation of Sintered Tungsten Alloys on Wetting of BAg Filler Metals

机译：电接触芯片材料的钎焊性研究（报告I）：烧结钨合金表面制备对BAg填充金属润湿的影响

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OKAMOTO Ikuo; OHMORI Akira; INAMURA Minoru; INUKAI Kazuhiro; SABURI Katsuo;
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年度 2013
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正文语种 eng
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Studies on Brazability of Electric Contact Chip Materials (Report I) : Effect of Surface Preparation of Sintered Tungsten Alloys on Wetting of BAg Filler Metals

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