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Electrodeposition of Sn-Ag Alloys and Its Connecting Reliability for Automotive Connectors

机译：SN-AG合金的电沉积及其汽车连接器的连接可靠性

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Hiroaki Nakano; Satoshi Oue; Masaaki Uranaka; Masataka Masuda; Hisaaki Fukushima; Yoshifumi Saka; Shigeru Sawada; Yasuhiro Hattori;
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年度 2009
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1. Electrodeposition of Sn-Ag Alloys and Evaluation of Connection Reliability for Automotive Connectors [J] . Hiroaki Nakano, Satoshi Oue, Masaaki Uranaka Materials transactions . 2010,第4期

机译：Sn-Ag合金的电沉积及汽车连接器的连接可靠性评估
2. Sn-Cu Alloy Electrodeposition and Its Connecting Reliability for Automotive Conneetors [J] . Hiroaki Nakano, Satoshi Oue, Daisuke Yoshihara Materials transactions . 2011,第6期

机译：Sn-Cu合金电沉积及其在汽车针车中的连接可靠性
3. Automotive connectors boast small pitch, mating reliability [J] . Electronic products . 2017,第4期

机译：汽车连接器具有小间距，匹配可靠性
4. Hybrid Electrodeposition of Ag-Graphene Composite Films on Cu Alloys for High-Conductive and Wear-Resistive Automotive Connectors [C] . Shizuka Sakaida, Songzhu Kure-Chu, Takashi Matsubara, Pacific Rim Meeting on Electrochemical and Solid-State Science . 2020

机译：用于高导电和耐磨汽车连接器Cu合金Ag-石墨烯复合膜的杂化电沉积
5. Determining the reliability and quality performance of a new universal electrical connector driver. [D] . Zeman, Ethan A. 2007

机译：确定新型通用电连接器驱动器的可靠性和质量性能。
6. Diffusion Barrier Performance of AlCrTaTiZr/AlCrTaTiZr-N High-Entropy Alloy Films for Cu/Si Connect System [O] . Chunxia Jiang, Rongbin Li, Xin Wang, 2020

机译：用于Cu / Si Connect系统的Alcrtatizr / AlcrtatizR-N高熵合金薄膜的扩散阻挡性能
7. Development of High Stress Relaxation Resistance 70Cu/30Zn Based Alloy ldquo;C44710rdquo; for Automotive Connector [O] . Keiichiro Oishi, Takashi Hokazon, Yasuhiro Tsugawa, 2016

机译：用于汽车连接器的高应力松弛电阻70CU / 30ZN合金“C44710”

Electrodeposition of Sn-Ag Alloys and Its Connecting Reliability for Automotive Connectors

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