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Determination of Equilibrium Shapes and Optimal Volume of Solder Droplets in the Assembly of Surface Mounted Integrated Circuits.

机译：表面安装集成电路组装中的焊料液滴的均衡形状和最佳体积的测定。

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L. M. Racz; J. Szekely;
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年度 1993
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2. A surface-mounted device assembly technique for small optics based on laser reflow soldering [J] . L. Stauffer, A. Wuersch, B. Gaechter, Optics and Lasers in Engineering . 2005,第3a5期

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3. Investigation of Equilibrium Droplet Shapes on Chemically Striped Patterned Surfaces Using Phase-Field Method [J] . Wu Yanchen, Wang Fei, Selzer Michael, Langmuir: The ACS Journal of Surfaces and Colloids . 2019,第25期

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4. Modeling of the paste withdrawal sub-process in the stencil printing of solder pastes for the reflow soldering of surface mount assemblies [C] . Mark Currie, NN Ekere, MHA Riedlin NEPCON west technical program conference and exhibition . 1998

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7. Cad process surface mounting. calculation of volume of solder for circuits in performance bga [O] . Khatsko Sergei, Karpenko Alexei, Хацько Сергей, 2010

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8. Assembly feasibility and reliability studies of surface mount circuit boards manufactured with lead-free solders [R] . Vianco, P. T. , Artaki, I. , Jackson, A. M. , 1994

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Determination of Equilibrium Shapes and Optimal Volume of Solder Droplets in the Assembly of Surface Mounted Integrated Circuits.

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