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Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC)

机译：基于二维集成电路（3D IC）的同轴直通硅 - 通孔（C-TSV）的热管理

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Fengjuan Wang; Ningmei Yu;
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年度 2016
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1. Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC) [J] . Fengjuan Wang, Ningmei Yu IEICE Electronics Express . 2016,第11期

机译：基于同轴硅通孔（C-TSV）的三维集成电路（3D IC）的热管理
2. Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit [J] . Shi B., Srivastava A., Bar-Cohen A. Circuits, Devices & Systems, IET . 2013,第5期

机译：微流体散热器和热硅通孔的协同设计，用于冷却三维集成电路
3. Through-silicon-via crosstalk model and optimization design for three-dimensional integrated circuits [J] . Qian Li-Bo, Zhu Zhang-Ming, Xia Yin-Shui, 中国物理：英文版 . 2014,第003期

机译：三维集成电路的硅通孔串扰模型和优化设计
4. 3D modeling and electrical characteristics of through-silicon-via (TSV) in 3D integrated circuits [C] . Liang Lei, Miao Min, Li Zhensong, 2011 12th International Conference on Electronic Packaging Technology High Density Packaging . 2011

机译：3D集成电路中的硅通孔（TSV）的3D建模和电气特性
5. Through-Silicon-via Inductor in Three-Dimensional Integrated Circuits: Modeling and Design for On-Chip Applications [D] . Tida, Umamaheswara Rao. 2019

机译：三维集成电路中的硅通孔电感：片上应用的建模与设计
6. Single-Grain Gate-All-Around Si Nanowire FET Using Low-Thermal-Budget Processes for Monolithic Three-Dimensional Integrated Circuits [O] . Tung-Ying Hsieh, Ping-Yi Hsieh, Chih-Chao Yang, 2020

机译：单粒门 - 全围绕单片三维集成电路的低热预算过程的Si纳米线FET
7. Thermal management of 3D integrated circuits with microchannel-based liquid cooling [O] . Hanhua Qian -1

机译：基于微通道的液体冷却3D集成电路的热管理

Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC)

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