首页> 外文OA文献 >Lithographic Properties of Positive Photosensitive Polyimide Insulator by Block Copolymerization.

【2h】

Lithographic Properties of Positive Photosensitive Polyimide Insulator by Block Copolymerization.

机译：嵌段共聚阳性光敏聚酰亚胺绝缘子的光刻性能。

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Taro Itatani; Masanori Komuro; Masahiro Aoyagi; Bun-Sil Jung; Shigemasa Segawa; Hiroshi Itatani; Masataka Miyamura; Shunichi Matsumoto;
展开▼
作者单位

展开▼
年度 2001
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Lithographic Properties of Positive Photosensitive Polyimide Insulator by Block Copolymerization [J] . Eun-Sil Jung, Shigemasa Segawa, Taro Itatani, Journal of Photopolymer Science and Technology . 2001,第1期

机译：正嵌段型正光敏聚酰亚胺绝缘子的平版印刷性能
2. Soft Baking Effect on Lithographic Performance by Positive Tone Photosensitive Polyimide [J] . Tomoyuki Yuba, Ryoji Okuda, Masao Tomikawa Journal of Photopolymer Science and Technology . 2010,第6期

机译：正色调光敏聚酰亚胺对光刻性能的软烘烤效应
3. Soft Baking Effect on Lithographic Performance by Positive Tone Photosensitive Polyimide [J] . Tomoyuki Yuba, Ryoji Okuda, Masao Tomikawa, Journal of Photopolymer Science and Technology . 2010,第6期

机译：正色调光敏聚酰亚胺对光刻性能的软烘烤效应
4. Interlayer Dielectric Process for LSI Circuits Using Positive Photosensitive Polyimide Synthesized by Block- Copolymerization [C] . Masahiro Aoyagi, Shigemasa Segawa, Eun-Sil Jung, Advances in Resist Technology and Processing XVIII . 2001

机译：通过嵌段共聚合合成正光敏聚酰亚胺的LSI电路层间介电工艺
5. Vapor deposition and patterning of auto-photosensitive polyimide. [D] . Chaplin, Stefanie Michelle. 2003

机译：自动光敏聚酰亚胺的气相沉积和图案化。
6. Differences in insulator properties revealed by enhancer blocking assays on episomes [O] . Timothy J. Parnell, Pamela K. Geyer 2000

机译：附加体上增强子阻断试验揭示了绝缘子性能的差异
7. Soft Baking Effect on Lithographic Performance by Positive Tone Photosensitive Polyimide [O] . Tomoyuki Yuba, Ryoji Okuda, Masao Tomikawa, 2010

机译：正音色光敏聚酰亚胺的柔软烘烤效果对光刻性能
8. Novel Photosensitive Polyimide Resist Consisting of a Soluble Polyimide and aBis(perfluorophenyl Azide) as a Cross-Linker [R] . Cai, S. X., Wybourne, M. N., Keana, J. F. 1993

机译：新型光敏聚酰亚胺抗蚀剂由可溶性聚酰亚胺和双（全氟苯基叠氮化物）作为交联剂组成

Lithographic Properties of Positive Photosensitive Polyimide Insulator by Block Copolymerization.

著录项

引文网络

相似文献

相关主题

期刊订阅