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On the stress measurement method using grain growth process of electrodeposited copper foil. (1st report Grain nucleation and grain growth)

机译：电沉积铜箔晶粒生长过程的应力测量方法。（第一个报告谷物成核和谷物生长）

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Seiichiro KITAOKA; Toshihiro KOBAYASHI; Kazuhiko OHSHIMA; Teruaki MIKURIYA;
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年度 1987
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1. Cyclic biaxial stress measurement method using the grain growth direction in electrodeposited copper foil [J] . Ono Y., Li C., Hino D. EURASIP journal on advances in signal processing . 2010 ,第18期

机译：利用电沉积铜箔中晶粒生长方向的循环双轴应力测量方法
2. Cyclic Biaxial Stress Measurement Method Using the Grain Growth Direction in Electrodeposited Copper Foil [J] . Yuichi Ono, Cheng Li, Daisuke Hino EURASIP journal on advances in signal processing . 2010 ,第1期

机译：电沉积铜箔中晶粒生长方向的循环双轴应力测量方法
3. Measurement of Contact Pressure by Electrodeposited Copper Foil: Measurement of Cyclic Pressure Using Grain Growth and Surface roughness of Electrodeposited Copper Foil [J] . Tatsuya Hasegawa, Seiichiro Kitaoka Review of Automotive Engineering . 2005 ,第3期

机译：电沉积铜箔的接触压力测量：利用晶粒长大和电沉积铜箔的表面粗糙度测量循环压力
4. Effect of Thickness on Grain Growth in Electrodeposited Copper Film by Cyclic Stressing [C] . Y. Iino Asian Pacific Conference Fracture and Strength . 2005

机译：循环应力厚度对电沉积铜膜晶粒生长的影响
5. Effect of ultra-thin liner materials on copper nucleation/wetting and copper grain growth. [D] . Mueller, Justin E. 2007

机译：超薄衬里材料对铜成核/润湿和铜晶粒生长的影响。
6. Scanning 3DXRD Measurement of Grain Growth Stress and Formation of Cu6Sn5 around a Tin Whisker during Heat Treatment [O] . Johan Hektor, Stephen A. Hall, N. Axel Henningsson, 2019

机译：扫描过程中3DXRD扫描测量锡晶须周围晶粒生长应力和Cu6Sn5的形成
7. Biaxial Stress Measurement Using Electrodeposited Copper Foil : Method to Judge the Sign of Biaxial Stress Ratio Using Grain Growth Direction [O] . Yuichi ONO, Cheng LI 2009

机译：使用电沉积铜箔的双轴应力测量：使用晶粒生长方向判断双轴应力比的迹象
8. Controlled Nucleation and Growth Process for Large-Grained Polycrystalline-Silicon Photovoltaics. Final Report [R] . Danforth, S. C., Haggerty, J. S. 1982

机译：大粒度多晶硅光伏控制成核与生长过程。总结报告

On the stress measurement method using grain growth process of electrodeposited copper foil. (1st report Grain nucleation and grain growth)

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