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Micro-Mechanical In Situ Measurements in Thin Film Systems Regarding the Determination of Residual Stress, Fracture Properties and Interface Toughness

机译：关于薄膜系统的微机械原位测量关于残留应力，断裂性能和界面韧性的测定

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R. Konetschnik; D. Kiener; D. Kozic; H.-P. Ganser; R. Brunner;
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1. Residual stress measurements and mechanical properties of AlN thin films as ultra-sensitive materials for nanoelectromechanical systems [J] . R. Grieselera J. Klausb M. Stubenrauchc K. Tonischc S. Michaelb J. Pezoldtc amp, P. Schaafa* Philosophical Magazine . 2012,第25a27期

机译：AlN薄膜作为纳米机电系统的超灵敏材料的残余应力测量和力学性能
2. Residual stress measurements and mechanical properties of AlN thin films as ultra-sensitive materials for nanoelectromechanical systems [J] . Grieseler R., Klaus J., Stubenrauch M., Philosophical magazine: structure and properties of condensed matter . 2012,第25a27期

机译：AlN薄膜作为纳米机电系统的超灵敏材料的残余应力测量和力学性能
3. MEASUREMENTS OF RESIDUAL STRESSES IN THIN FILMS DEPOSITED ON SILICON WAFERS BY INDENTATION FRACTURE [J] . T.-Y. ZHANG, L.-Q. CHEN, R. FU Acta Materialia . 1999,第14期

机译：用压痕断裂法测量沉积在硅晶片上的薄膜中的残余应力
4. Residual stress and fracture toughness in Pb(Zr_(0.58)Ti_(0.42))O_3 piezoelectric thin film [C] . Y. C. Zhou, X.J. Zheng International conference on experimental mechanics . 2002

机译：Pb的残余应力和断裂韧性（Zr_（0.58）Ti_（0.42））O_3压电薄膜
5. A method for fracture toughness measurement in thin films and coatings. [D] . Benson, Brad Alan. 1993

机译：一种测量薄膜和涂层断裂韧性的方法。
6. Theoretical Study on Synchronous Characterization of Surface and Interfacial Mechanical Properties of Thin-Film/Substrate Systems with Residual Stress Based on Pressure Blister Test Technique [O] . Zhi-xin Yang, Jun-yi Sun, Ke Li, 2018

机译：基于水泡试验技术的残余应力薄膜/基体系统表面和界面力学性能同步表征的理论研究
7. Determination of residual stress and interface adhesion toughness of thin films by blisters [O] . Bo Yuan, Christopher M. Harvey, Gary W. Critchlow, 2019

机译：水泡薄膜残留应力和界面粘附韧性的测定
8. Effects of Thin Compressive Films on Indentation Fracture Toughness Measurements [R] . Kobrin, P. H., Harker, A. B. 1988

机译：薄膜压缩薄膜对压痕断裂韧性测量的影响

Micro-Mechanical In Situ Measurements in Thin Film Systems Regarding the Determination of Residual Stress, Fracture Properties and Interface Toughness

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