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Enhanced thermal sensitivity of MEMS bolometers integrated with nanometer-scale hole array structures

机译:增强了与纳米尺度孔阵列结构集成的MEMS钻头的热敏性

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摘要

We have fabricated two-dimensional nanometer-scale hole array structures on GaAs doubly-clamped microelectromechanical system (MEMS) beam resonators to modulate their thermal properties. Owing to the reduction in the thermal conductance of the MEMS beams by introducing the hole array structures, the nano-porous MEMS bolometers show 2-3 times larger thermal sensitivities than the unpatterned reference sample. Furthermore, since the heat capacitance of the MEMS beams is also reduced by introducing the hole array, the thermal decay time of the patterned MEMS beams is increased only by about 30-50%, demonstrating the effectiveness of the hole array structures for enhancing the thermal sensitivities of bolometers without significantly deteriorating their operation bandwidths.
机译:我们在GaAs双夹紧的微机电系统(MEMS)光束谐振器上制造了二维纳米尺度孔阵列结构,以调节它们的热性能。由于通过引入空穴阵列结构来降低MEMS光束的热敏,纳米多孔MEMS弓孔仪比未绘图的参考样品显示出2-3倍的热敏性。此外,由于通过引入空穴阵列也减小了MEMS光束的热电容,因此图案化MEMS光束的热衰减时间仅增加了大约30-50%,展示了孔阵列结构的有效性来增强热量大计的敏感性而不明显恶化其操作带宽。

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