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Thermal stability of ultrahard polycrystalline diamond composite materials

机译:超硬多晶金刚石复合材料的热稳定性

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摘要

Thermal stability of the ultrahard polycrystalline diamond (UHPCD) composite material developed by the reinforcement of the polycrystalline diamond (PCD) with chemical vapor deposition (CVD) diamond has been investigated in a flow of argon at 1200 °C. The indentation, Raman spectra and wear test have been performed to compare hardness, C–C structure and wear resistance of untreated and thermal treated UHPCD. It has been shown that the hardness of CVD diamond in UHPCD attains 133±7 GPa after high pressure and high temperature, while after thermal treatment the hardness decreases to 109±3 GPa, and the wear resistance of the thermal treated UHPCD decreases from 0.17 to 0.6 mg/km. The narrowing of full width at half maximum and shift of Raman peak to lower frequencies of CVD diamond in thermal treated UHPCD imply a decrease of crystal structural defects and compressive stresses, which results in a drop of the hardness of CVD diamond in a thermal treated UHPCD. The higher wear rate of thermal treated UHPCD is due to the lower hardness.
机译:通过在1200°C的氩气流中研究了用化学气相沉积(CVD)金刚石增强多晶金刚石(PCD)形成的超硬多晶金刚石(UHPCD)复合材料的热稳定性。已经进行了压痕,拉曼光谱和磨损测试,以比较未经处理和热处理过的UHPCD的硬度,CC结构和耐磨性。结果表明,高压高温下CVD金刚石的硬度在高压和高温下达到133±7 GPa,而热处理后硬度降低到109±3 GPa,热处理后的UHPCD耐磨性从0.17降低到1.03 GPa。 0.6毫克/公里。在热处理的UHPCD中,半峰的全宽变窄以及拉曼峰向CVD金刚石的较低频率移动暗示了晶体结构缺陷和压缩应力的减少,这导致了在热处理的UHPCD中CVD金刚石的硬度下降。热处理的UHPCD的较高磨损率是由于较低的硬度。

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