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Fabrication and Properties of Ni and Ni-W Electroplated Molds Using LIGA-like Process for Replication of Micro Components

机译：利用LIGA样方法进行Ni和Ni-W电镀模具的制造和性质，用于复制微量组分

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1. How mold inserts influence the replication of metallic microparts produced by electroplating into two-component templates [J] . Juergen Prokop, Jochen Heneka, Julia Lorenz, Microsystem Technologies . 2010,第s8a9期

机译：模具插件如何影响通过电镀成两组分模板而产生的金属微零件的复制
2. How mold inserts influence the replication of metallic microparts produced by electroplating into two-component templates [J] . Juergen Prokop, Jochen Heneka, Julia Lorenz, Microsystem technologies . 2010,第8a9期

机译：模具插件如何影响通过电镀成两组分模板而产生的金属微零件的复制
3. Fabrication of Al/Ni/Cu composite by accumulative roll bonding and electroplating processes and investigation of its microstructure and mechanical properties [J] . Ali Shabani, Mohammad Reza Toroghinejad, Ali Shafyei Materials Science and Engineering . 2012,第DECa15期

机译：累积轧制和电镀工艺制备Al / Ni / Cu复合材料及其微观组织和力学性能
4. Fabrication of Ni-W Electroplated Micro Diamond Tools with Carbide Substrate and Their Application to the Grooving of Silicon without/with Ultrasonic Vibration [C] . H. Onikura, O. Ohnishi, K. Nishihara, International Conference of the European Society for Precision Engineering and Nanotechnology vol.2 . 2005

机译：带有硬质合金基体的Ni-W电镀微金刚石工具的制造及其在有/无超声振动的硅开槽中的应用
5. Microstructure and Microcantilever Fracture Toughness of Electrodeposited Ni-W Alloys [D] . Yin, Denise. 2017

机译：电沉积Ni-W合金的微观结构和微膜骨折韧性
6. Study on Electrical Explosion Properties of Cu/Ni Multilayer Exploding Foil Prepared by Magnetron Sputtering and Electroplating [O] . Fan Lei, Qin Ye, Shuang Yang, 2020

机译：磁控溅射电镀铜/镍多层爆炸箔电爆炸性能的研究
7. Fabrication of Ni-W Electroformed Mold for Thermal Imprint of Borosilicate Glass [O] . Manabu YASUI, Satoru KANEKO, Masaharu TAKAHASHI, 2013

机译：用于硼硅酸盐玻璃热印记的Ni-W电铸模具的制造
8. Temperature Dependence of Tensile Properties of 316 Stainless Steel, FeCrNiMo, FeCrNi, Ni-W and Ni Foils [R] . Parente, C. B. R., Jung, P. 1981

机译：316不锈钢，FeCrNimo，FeCrNi，Ni-W和Ni箔的拉伸性能的温度依赖性

Fabrication and Properties of Ni and Ni-W Electroplated Molds Using LIGA-like Process for Replication of Micro Components

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