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Аutomated method for determining the etch pits density on crystallographic planes of large semiconductor crystals

机译:确定大型半导体晶体晶体平面上蚀刻坑密度的自动方法

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摘要

A method for express automatic evaluation of the dislocation density on the crystal surfaces has been developed. The work involves creation of a software that allows automatical determining the number of etch pits with a defined geometric shape, which are seen in the microscope view field, and calculation of the density of those etch pits. In addition, adaptation of a metallographic microscope for the above measurements has been made. The developed method can be used to greatly speed up the maping of etch pits density over the area of large crystals. For example, duration of about 400 measurements of etch pits density made in various sites of 330×150 mm surface of the optical germanium crystal plate and of maping the etch pits distribution over this surface made by the developed method is about 40 min, while duration of the same measurements made by the traditional method for visual counting the number of etch pits seen in the eyepiece of the microscope is several dozens of hours. Use of the described method has allowed us to determine the geometric position of maximum internal stress in large optical germanium plates grown by horizontal unidirectional crystallization. This method has been already included in the metrological complex of serial production of large-area plates made of Na-doped optical germanium – a new material of infrared technique, developed and introduced into production at the V. Lashkaryov Institute of Semiconductor Physics, NAS of Ukraine.
机译:已经开发出一种用于自动评估晶体表面上的位错密度的方法。这项工作涉及创建一个软件,该软件可以自动确定在显微镜视场中可以看到的具有定义的几何形状的蚀刻坑的数量,并计算这些蚀刻坑的密度。另外,已经使金相显微镜适于上述测量。所开发的方法可用于大大加快大晶体区域上蚀刻坑密度的映射。例如,在光学锗晶体板的330×150 mm表面的各个位置进行的大约400次蚀刻坑密度测量以及通过开发的方法绘制该表面上的蚀刻坑分布图的持续时间约为40分钟,而持续时间通过传统方法对显微镜的目镜中可见的蚀刻凹坑的数量进行视觉计数的相同测量结果需要花费数十个小时。使用所描述的方法使我们能够确定通过水平单向结晶生长的大型光学锗板中最大内部应力的几何位置。这种方法已经包含在由掺钠光学锗制成的大面积板的批量生产的计量综合体中,掺钠光学锗是一种新型的红外技术,已由美国NAS的V. Lashkaryov半导体物理研究所开发并投入生产。乌克兰。

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