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Structure perfection variations of Si crystals grown by Czochralski or floating zone methods after implantation of oxygen or neon atoms followed by annealing

机译:氧或氖原子注入并退火后,通过直拉法或浮区法生长的硅晶体的结构完善变化

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摘要

Structure perfection of the silicon crystals grown by the Czochralski and floating zone methods after implantation with oxygen or neon fast iones followed by annealing at the temperatures T ~ 1050-1150 ⁰0C, when large SiOx precipitates were formed, was studied by means of various X-ray diffraction methods. Considerable increments of integral reflectivities for different Bragg reflections of such samples in comparison with those calculated for a perfect crystal were detected. Broadening of the spatial intensity distribution curves for the Bragg-diffracted beams taken by a single crystal spectrometer as well as the maps of the diffuse isointensity distribution near a reciprocal lattice point, registered by the Philips high-resolution diffractometer, are shown. All of these diffraction effects related to creation of the SiOx precipitates formed on structural damages caused by implantation of oxygen or neon ions and subsequent annealing. Contrary to FZSi, where the appearence of SiOx precipitates was discovered due to intensive diffuse scattering near the layer contained the implanted oxygen ions only, in the case of CZSi samples with larger concentration of oxygen (up to 1*10¹⁸ at/cm³) such defects were formed not only near the burried layer, created by ions of oxygen or neon (with energy E = 4 MeV, dose 10¹⁴cm⁻²) but in a bulk of a crystal. Annealing of the FZSi crystals implanted by oxygen (E ~ 200 keV, dose ~ 10¹⁶-10¹⁷ cm⁻²) at enhanced hydrostatic pressure, additionally stimulated SiOx precipitation close to the implanted layer.
机译:研究了通过Czochralski和浮区法生长的硅晶体在注入氧或氖固定离子之后,在T〜1050-1150⁰0C退火,形成大的SiOx沉淀物时,形成的晶体结构的完善,方法是通过各种X-射线衍射法。与为完美晶体计算的反射率相比,检测到了此类样品不同布拉格反射的积分反射率的显着增加。显示了由单晶光谱仪拍摄的布拉格衍射光束的空间强度分布曲线的展宽以及飞利浦高分辨率衍射仪记录的在倒易晶格点附近的散射等强度分布图。所有这些衍射效应都与由于氧或氖离子注入和随后的退火引起的结构破坏而形成的SiOx沉淀有关。与FZSi相反,由于在仅包含注入的氧离子的层附近发生了强烈的扩散散射,因此发现了SiOx沉淀的出现,而对于CZSi样品中的氧气浓度较高(高达1 * 10 15 at /cm³),这种缺陷不仅在由氧或氖离子(能量E = 4 MeV,剂量为10 15 cm -2)产生的掩埋层附近形成,而且在大量晶体中形成。用氧(E〜200 keV,剂量〜10 17 -10 -1 cm-2)在增强的静水压力下对FZSi晶体进行退火处理,进一步刺激了靠近注入层的SiOx沉淀。

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