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Improvement of Pot Life in the Epoxy Resin-based Adhesive Formulation by Size Control and Coating of Curing Accelerator Powders

机译：通过尺寸控制和固化促进剂粉末涂层改善环氧树脂基粘合剂制剂的钾寿命

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Jun-Sik Lee; Chang-Yong Hyun; Jong-Hyun Lee;
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年度 2008
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1. A novel tube-structure entrapped curing accelerator for prolonging the shelf-life of epoxy resin-based microelectronic packaging material [J] . Zhang Y., Cao M., Guo GQ., Journal of Materials Chemistry: An Interdisciplinary Journal dealing with Synthesis, Structures, Properties and Applications of Materials, Particulary Those Associated with Advanced Technology . 2002,第8期

机译：一种新型的管结构截留固化促进剂，用于延长环氧树脂基微电子包装材料的保存期限
2. TWO IDEAL APPLICATIONS FOR THE LOW ENERGY ELECTRON-BEAM ACCELERATOR: VULCANIZATION OF PRESSURE-SENSITIVE ADHESIVES AND CONTROLLED THROUGH-CURING OF COATINGS ON PARQUET [J] . P. Holl Radiation Physics and Chemistry . 1995,第4a6Pt2期

机译：低能电子束加速器的两种理想应用：压敏粘合剂的硫化和喷涂涂层的可控通孔固化
3. Effect of nano-sized calcium carbonate on cure kinetics and properties of polyester/epoxy blend powder coatings [J] . Kalaee M., Akhlaghi S., Nouri A., Progress in Organic Coatings: An International Review Journal . 2011,第2期

机译：纳米碳酸钙对聚酯/环氧共混粉末涂料固化动力学和性能的影响
4. Cure Kinetics of Epoxy Powder Coatings via Differential Scanning Calorimetry: Implications on Processing and Formulation [C] . Weih Q. Lee Annual international waterborne, high-solids, and powder coatings symposium . 2018

机译：差示扫描量热法测定环氧粉末涂料的固化动力学：对加工和配方的影响
5. An investigation of the relationship between the bulk properties and the adhesive performance of dicyandiamide cured epoxy adhesive systems [D] . Murray, Catherine Anne. 1992

机译：双氰胺固化环氧胶粘剂体系的本体性能与胶粘性能之间关系的研究
6. Effect of Particle Sizes of Nickel Powder on Thermal Conductivity of Epoxy Resin-Based Composites under Magnetic Alignment [O] . Zheng Jin, Fei Liang, Wenzhong Lu, 2019

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7. Structure and protective properties of epoxy-polyester powder coatings containing curing accelerator [O] . V. V. Komar, N. V. Kulinich, N. P. Krutko 2019

机译：含有固化促进剂的环氧聚酯粉末涂料的结构和保护性能

Improvement of Pot Life in the Epoxy Resin-based Adhesive Formulation by Size Control and Coating of Curing Accelerator Powders

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