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Mass Balance and Deposition Mechanism in Electroless Pd-P Alloy Plating from a Ethylenediamine Complex Bath Using Hypophosphite as a Reducing Agent.

机译：用次磷酸盐作为还原剂从乙二胺络合物浴中镀乙酰化络合物镀层的质量平衡和沉积机理。

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Shozo MIZUMOTO; Hidemi NAWAFUNE; Noriyuki NISHIKAWA; Masaki HAGA; Ei UCHIDA;
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年度 1993
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1. Electroless Palladium Plating from an Ethylenediamine Complex Bath using Phosphite as a Reducing Agent [J] . H. Nawafune, S. Mizumoto, M. Haga, Transactions of the Institute of Metal Finishing . 1996,第Pt1期

机译：使用亚磷酸酯作为还原剂的乙二胺复合镀液的化学镀钯
2. Effect of surface roughness and mass transfer enhancement on the performance characteristics of nickel-hypophosphite electroless plating baths for metal-ceramic composite membrane fabrication [J] . Vijaya Kumar Bulasara, Oruganti Chandrashekar, Ramgopal Uppaluri Chemical Engineering Research & Design: Transactions of the Institution of Chemical Engineers . 2011,第11期

机译：表面粗糙度和传质增强对金属陶瓷复合膜制造中次磷酸镍化学镀液性能的影响
3. Electroless deposition of Ni-P and Ni-P-Re alloys from acidic hypophosphite baths [J] . Kazimierczak Honorata, Wierzbicka-Miernik Anna, Kwiecien Izabella, Electrochimica Acta . 2019,第期

机译：来自酸性次磷酸盐浴的Ni-P和Ni-P-Re合金的无电沉积
4. Electroless Ni-Co-Cu-P Alloy Deposition in Alkaline Hypophosphite Based Bath [C] . M. Zaimi, M.N. Azran, M. Khaizaki Scientific Conference of the Microscopy Society Malaysis . 2016

机译：碱性次磷酸盐浴中的化学镀Ni-Cu-P合金沉积
5. Electroless Plating of Palladium on Stainless Steel Substrates in Hydrazine Solutions: A Study of the Relationships Between Bath Parameters, Deposition Mechanisms, and Deposit Morphologies. [D] . Davis, Stacy. 2011

机译：在肼溶液中在不锈钢基材上化学镀钯：镀液参数，沉积机理和沉积形态之间关系的研究。
6. Effect of Phosphorus Codeposition on Properties of Palladium-Phosphorus Alloys Deposited from Electroless Plating Baths Using Hypophosphite as a Reducing Agent. [O] . Hidemi NAWAFUNE, Shozo MIZUMOTO, Masaki HAGA, 1996

机译：磷沉重沉积对磷酸盐磷酸盐合金的性质，用次磷酸盐作为还原剂沉积在化学镀浴中沉积的化学镀浴。
7. Copper Pyrophosphate/PY61H Plating Bath: Chemical Variables, Synergism, and Electrodeposition Mechanism. Topical Report [R] . Borhani, K. J. 1981

机译：焦磷酸铜/ pY61H电镀浴：化学变量，协同作用和电沉积机理。专题报道

Mass Balance and Deposition Mechanism in Electroless Pd-P Alloy Plating from a Ethylenediamine Complex Bath Using Hypophosphite as a Reducing Agent.

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