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Effects of Current Density and Organic Additives on via Copper Electroplating for 3D Packaging

机译：电流密度和有机添加剂对3D包装铜电镀的影响

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Eun-Hey Choi; Youn-Seoung Lee; Sa-Kyun Rha;
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年度 2012
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1. Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density [J] . Tae-Gyu Woo, Il-Song Park Journal of Korean Institute of Metal and Materials . 2020,第1期

机译：有机添加剂对高电流密度的电气性能变化
2. Synthesis and practicability of novel additives for copper electroplating with semiconductor packaging [J] . Sugimoto M, Yamaguchi K, Kouzai H, Journal of Applied Polymer Science . 2005,第3期

机译：半导体封装电镀铜用新型添加剂的合成及实用性
3. Electroplating of copper in the presence of 5,6-dihydropyrimidine-2-(1h)-thione, 2-methylthiopyrimidine-4-(1h)-one, 2-thiopyrimidine-4-(1h)-ones, and 2,4-pyrimidine(1h,3h)-dione derivatives as organic additives [J] . Ahmed A.-M.M., Abdel-Rahman A.A.-H., El Adl A.F. Journal of Dispersion Science and Technology . 2011,第1a3期

机译：在5,6-二氢嘧啶-2-（1h）-硫酮，2-甲基硫代嘧啶-4-（1h）-one，2-硫代嘧啶-4-（1h）-one和2,4-存在下进行铜电镀嘧啶（1h，3h）-二酮衍生物作为有机添加剂
4. Bath additive and current density effects on copper electroplating fill of Cu damascene structures [C] . Robert D.Mikkola, Qing-Tang Jiang, Ronald Carpio Brad Carpenter Symposium on Advanced Interconnects and Contacts held April 5-7, 1999,San Francisco, California, U.S.A. . 1999

机译：浴添加剂和电流密度对铜镶嵌结构的铜电镀填充的影响
5. Effect of various additives' ratios and concentrations on cathode quality during copper electrorefining under high current densities. [D] . Veilleux, Bertrand. 2002

机译：高电流密度下铜电精炼过程中各种添加剂的比例和浓度对阴极质量的影响。
6. Copolymer of Pyrrole and 14-Butanediol Diglycidylas an Efficient Additive Leveler for Through-Hole Copper Electroplating [O] . Jing Li, Guoyun Zhou, Yan Hong, 2020

机译：吡咯与14-丁二醇二缩水甘油基的共聚物作为通孔铜电镀的高效添加剂矫平剂
7. Effect of Organic Additives on Formation and Growth Behavior of Micro-Void in Electroplating Copper Films [O] . Miki Moriyama, Shinya Konishi, Susumu Tsukimoto, 2004

机译：有机添加剂对电镀铜薄膜微孔形成和生长行为的影响
8. On-Line Monitoring of Inorganic Additives in Copper Electroplating Baths [R] . Borhani, K. J. 1982

机译：铜电镀液中无机添加剂的在线监测

Effects of Current Density and Organic Additives on via Copper Electroplating for 3D Packaging

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