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Some aspects of deposition of conductive, dielectric and protective coatings on insulators with using arc discharge dc and RF bias

机译:使用电弧放电直流和射频偏压在绝缘体上沉积导电,介电和保护涂层的某些方面

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摘要

Investigation results for technological process of low temperature plasma deposition of functional coverings for dielectric substrate at low temperatures (50…250 oC) are shown. Combined high frequency and arc plasma sources were used to provide high deposition rate and an opportunity to operate with heat sensitive substrate such as plastic, glass etc. Using this method there were obtained: pads on detectors of ionizing radiation, optically transparent protecting coverings for plexiglass, connecting coverings on mica for ultra-frequency emitter.
机译:显示了在低温(50…250 oC)下对电介质基板的功能性覆盖层进行低温等离子体沉积的工艺过程的研究结果。结合了高频和电弧等离子体源,可提供较高的沉积速率,并有机会与热敏性基材(如塑料,玻璃等)一起使用。使用此方法,可获得:电离辐射探测器上的焊盘,有机玻璃的光学透明保护罩,连接云母上的超频发射器覆盖层。

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