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Study on Intensification Behavior of Bismuth Ions on Gold Cyanide Leaching

机译:铋离子对金氰化物浸出的强化行为研究

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摘要

Gold cyanide leaching is inefficient with conventional cyanidation. Bismuth ions can improve the efficiency of gold cyanidation by intensifying gold dissolution. The electrochemical behavior, structure information, and surface product of gold anodic dissolution were studied during the intensification of bismuth ions on gold cyanide leaching. The electrochemical analysis showed that the bismuth ions can not only improve anode current density, but also make gold dissolve at a lower potential, increase the corrosion current and intensify gold anodic dissolution. The microstructure analysis showed that bismuth ions intensified the cyanide corrosion of the gold surface, causing a large number of loose honeycombs, gullies, pits, and large holes on the gold surface. The XPS, FT-IR, and Raman analysis showed that there is weak information of C≡N in the spectrum of Bi intensification contrasting to that of conventional cyanidation. Cyanide compounds may be the insoluble AuCNads, which does not deposit on the surface of gold plate after Bi intensification cyanidation. The insoluble intermediate AuCNads is likely to react promptly with CN- to form soluble Au(CN ) 2 − , making less insoluble AuCNads deposits on the gold surface. Therefore, bismuth ions can promote the dissolution of insoluble AuCNads, prevents its passivation film to cover around the gold plate, keeps cyanide good contact with gold, and finally accelerates the cyanide dissolution of gold.
机译:常规氰化含金氰化物浸出效率低。铋离子通过强化金溶解可以提高金黄氰化的效率。研究了金阳极溶解的电化学行为,结构信息和表面产物在金氰酰胺浸出的铋离子的增强过程中研究。电化学分析表明,铋离子不仅可以改善阳极电流密度,还可以使金溶解在较低的电位下,增加腐蚀电流并加强金阳极溶解。微观结构分析表明,铋离子加剧了金表面的氰化物腐蚀,导致金表面上的大量松散的蜂窝状,沟渠,凹坑和大孔。 XPS,FT-IR和拉曼分析表明,在与常规氰化的比对比的BI强度范围内C 1N的信息较弱。氰化物化合物可以是不溶性的Aucnads,在Bi强化氰化后不沉积在金板的表面上。不溶性中间体AUCNADS可能与CN-迅速反应,以形成可溶性Au(CN)2 - ,使得在金表面上的不溶性Aucnads沉积物。因此,铋离子可以促进不溶性AUCNADS的溶解,防止其钝化膜在金板上覆盖,保持氰化物与黄金良好接触,最后加速金的氰化物溶解。

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