首页> 外文OA文献 >Relationship between the crack growth resistance of printed wiring boards and the mechanical properties of matrix resin.

【2h】

Relationship between the crack growth resistance of printed wiring boards and the mechanical properties of matrix resin.

机译：印刷配线板裂纹生长阻力与基质树脂力学性能的关系。

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Junichi KATAGIRI; Akira NAGAI; Akio TAKAHASHI; Shigeo AMAGI; Nobuaki OOKI;
展开▼
作者单位

展开▼
年度 1991
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Thermal cracking of waste printed wiring boards for mechanical recycling by using residual steam preprocessing [J] . Yao CHEN, Jinhui LI, Huabo DUAN, 中国环境科学与工程前沿：英文版 . 2011,第002期

机译：使用残余蒸汽预处理，对机械回收的废印刷布线热裂纹
2. The effect of staggered matrix crack induced delamination growth on the mechanical properties of cross-ply laminates [J] . Jafari Sepideh Rezaei, Farrokhabadi Amin, Montesano John Composite Structures . 2021,第Sepa期

机译：交错基质裂纹诱导分层增长对交叉层层压材料的力学性能的影响
3. CRACK GROWTH RESISTANCE AND MECHANICAL PROPERTIES OF LARGE-DIAMETER PIPES AND SHELLS [J] . A. A. Ostsemin Russian engineering research . 2003,第10期

机译：大口径管壳的抗裂纹扩展性能和力学性能
4. Critical size of crack propagation from residual void in micro via in printed wiring boards [C] . Lee Hyo-Soo 2010 Proceedings 60th Electronic Components and Technology Conference . 2010

机译：印刷电路板中微孔中残留空隙引起的裂纹扩展的临界尺寸
5. A theoretical framework for the dynamic analysis of a printed wiring board under mechanical and thermal loading [D] . He, Xiaoling 2000

机译：机械和热负荷下印刷线路板动态分析的理论框架
6. Relationships between Mechanical Properties and Extracellular Matrix Constituents of the Cervical Stroma during Pregnancy [O] . Michael House, David L. Kaplan, Simona Socrate -1

机译：孕期宫颈间质的力学性能和细胞外基质成分之间的关系
7. Electrical properties of printed wiring boards. Electrical properties of Sandia/Bendix Standard Process printed wiring boards [O] . C.W. Jennings 1976

机译：印刷配线板的电气性能。 Sandia / Bendix标准工艺印花电路板的电气特性

Relationship between the crack growth resistance of printed wiring boards and the mechanical properties of matrix resin.

著录项

引文网络

相似文献

相关主题

期刊订阅