首页> 外文OA文献 >Special Articles: Theme of Advanced Assembly and Packaging Technology. What Kind of Materials are Being Considered for the Next Generation Assembly?

【2h】

Special Articles: Theme of Advanced Assembly and Packaging Technology. What Kind of Materials are Being Considered for the Next Generation Assembly?

机译：特殊文章：先进的装配和包装技术主题。下一代组装正在考虑什么样的材料？

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Masamitsu AOKI;
展开▼
作者单位

展开▼
年度 1992
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. SELF-ASSEMBLY AND DIRECTED ASSEMBLY OF ADVANCED MATERIALS This special issue of the Journal of Materials Research contains articles that were accepted in response to an invitation for manuscripts. [J] . Amit Goyal, Jagdish Narayan, Qinghuang Lin Journal of Materials Research . 2011,第2期

机译：先进材料的自组装和直接装配本期《材料研究》的特刊中包含因应手稿邀请而被接受的文章。
2. The Largest Conference Program for Microelectronics, Assembly, Reliability, Emerging Applications, Materials and Advanced Packaging in the Fall of 2017 [J] . Advancing Microelectronics . 2017,第5期

机译：2017年秋季最大的微电子，组装，可靠性，新兴应用，材料和先进封装会议计划
3. Editorial-Special Issue “Macromolecular Self-Assembly Materials: From Modeling to Advanced Applications” [J] . Salvatore Magazù, Domenico Lombardo Materials . 2020,第6期

机译：编辑专用问题“大分子自组装材料：从建模到高级应用”
4. A HIGH THROUGHPUT, LOW COST ASSEMBLY APPROACH FOR LED IMS PACKAGES TO HEAT SINK USING ADVANCED THERMAL INTERFACE MATERIALS [C] . Swapan K. Bhattacharya, Fei Xie, Han Wu, International Symposium on Microelectronics . 2016

机译：使用先进的热界面材料，LED IMS封装的高吞吐量，低成本装配方法，用于散热器
5. Assembly process development for fine pitch (0.4 mm) package-on-package devices in a lead-free assembly environment. [D] . Vijayanath, Vignesh. 2010

机译：在无铅组装环境中开发小间距（0.4 mm）层叠封装器件的组装工艺。
6. Editorial-Special Issue Macromolecular Self-Assembly Materials: From Modeling to Advanced Applications [O] . Salvatore Magazù, Domenico Lombardo 2020

机译：社论特刊大分子自组装材料：从建模到高级应用
7. Special Articles: Theme of Advanced Assembly and Packaging Technology. About Classification of Assembly Technology. [O] . Kenzo HATADA 1992

机译：特殊文章：先进的装配和包装技术主题。关于组装技术的分类。
8. Design Guide for Packaging and Offsite Transportation of Nuclear Components, Special Assemblies, and Radioactive Materials Associated With Nuclear Explosives and Weapons Safety Program. [R] . Leduc, D. 1994

机译：与核爆炸和武器安全计划相关的核部件，特种部件和放射性材料的包装和非现场运输设计指南。

Special Articles: Theme of Advanced Assembly and Packaging Technology. What Kind of Materials are Being Considered for the Next Generation Assembly?

著录项

引文网络

相似文献

相关主题

期刊订阅