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Design of Thermal Expansion Coefficient for Multilayer Printed Wiring Boards.

机译：多层印刷线路板热膨胀系数设计。

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Hajime NAKAYAMA; Hiroshi KAWAZOE; Sigeo SHIOTA; Masahiro NAKAO; Akira SHIMIZU;
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年度 1993
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1. Solution-processable CF3-substituted ductile polyimides with low coefficients of thermal expansion as novel coating-type protective layers in flexible printed circuit boards [J] . Ishii Junichi, Yokoyama Naoki, Hasegawa Masatoshi Progress in Organic Coatings: An International Review Journal . 2016,第Null期

机译：具有低热膨胀系数的可溶液加工的CF3取代的延展性聚酰亚胺，作为柔性印刷电路板中的新型涂层型保护层
2. Materials, Processes, and Performance of High-Wiring Density Buildup Substrate With Ultralow-Coefficient of Thermal Expansion [J] . Yamanaka K., Kobayashi K., Hayashi K., Components and Packaging Technologies, IEEE Transactions on . 2010,第2期

机译：具有超低热膨胀系数的高配线密度积层基板的材料，工艺和性能
3. Tuning thermal expansion coefficient of copper-multilayer graphene thermal management materials through tailoring interfacial microstructure [J] . Wang Xueliang, Liu Yong, Wang Xin, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2021,第1期

机译：通过剪裁界面微观结构调节铜 - 多层石墨烯热管理材料的热膨胀系数
4. Low Thermal Expansion and High Heat Dissipation Printed Wiring Boards [C] . Sohei Samejima, Sadao Sato, Tsuyoshi Ozaki, IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain . 2008

机译：低热膨胀和高散热印刷线路板
5. Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards. [D] . Fu, Chia-Yu. 1999

机译：内部状态变量模型在印刷线路板的热加工和电镀通孔的可靠性中的应用。
6. Phase Transition and Coefficients of Thermal Expansion in Al2−xInxW3O12 (0.2 ≤ x ≤ 1) [O] . Andrés Esteban Cerón Cortés, Anja Dosen, Victoria L. Blair, 2021

机译：Al2-xinxW3O12中热膨胀的相转变和系数（0.2≤x≤1）
7. Future Plan for Printed Wiring Boards. Printed Wiring Boards Design Environment Based on Framework. [O] . Hidemi YOKOKAWA 1993

机译：印刷布线板的未来计划。基于框架的印刷布线板设计环境。
8. Low thermal coefficient of expansion printed wiring boards. Final report. [R] . Desch, J. K. 1992

机译：低热膨胀系数印刷线路板。总结报告。

Design of Thermal Expansion Coefficient for Multilayer Printed Wiring Boards.

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