Lead Free Assemble Technology by Anisotropic Conductive Film.

机译：通过各向异性导电膜引入免费组装技术。

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Isao Tsukagoshi; Koji Kobayashi; Atsuo Nakajima;
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年度 1995
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专利

1. A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging [J] . S. Manian Ramkumar, Krishnaswami Srihari Journal of Electronic Packaging . 2007,第2期

机译：一种用于无铅表面贴装电子封装的新型各向异性导电胶
2. High performance anisotropic conductive adhesives for lead-free interconnects [J] . Yi Li, C. P. Wong Soldering & Surface Mount Technology . 2006,第2期

机译：用于无铅互连的高性能各向异性导电胶
3. Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications [J] . HAI DONG, ZHUQING ZHANG, C.P.WONG Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology . 2005,第2期

机译：用于潜在的无铅各向异性导电胶的纳米粒子接头的分子动力学研究
4. EVALUATION OF A NOVEL ANISOTROPIC CONDUCTIVE ADHESIVE SHEAR UNDER MULTIPLE TIN-LEAD AND LEAD-FREE REFLOW CYCLES FOR PACKAGE- ON-PACKAGE (POP) ASSEMBLY [C] . Dustin DAngelo, S. Manian Ramkumar, Luke Wentlent, ASME international mechanical engineering congress and exposition . 2013

机译：套装（POP）组装的多铅无铅回流循环下新型各向异性导电胶剪切的评估
5. Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead -free surface mount electronics assembly [D] . Ramkumar, S. Manian 2007

机译：用于无铅表面贴装电子组件的新型各向异性导电胶的工艺分析和性能表征
6. Direct Printing of 1-D and 2-D Electronically Conductive Structures by Molten Lead-Free Solder [O] . Chien-Hsun Wang, Ho-Lin Tsai, Weng-Sing Hwang 2017

机译：熔融无铅焊料直接印刷一维和二维电子导电结构
7. Lead Free Assemble Technology by Conductive Adhesive. [O] . Tadashi Nakamura 1995

机译：导电粘合剂无铅组装技术。

Lead Free Assemble Technology by Anisotropic Conductive Film.

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