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Recent Trend on Microfabrication of Circuit Technology. Design and Performance of Build up Structure Printed Circuit Board.

机译：电路技术微型制作趋势。构建结构印刷电路板的设计与性能。

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Yutaka TSUKADA;
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年度 1995
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1. Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances [J] . Valentin Bissuel, Michel Brizoux, Arnaud Grivon, Journal of Electronic Packaging . 2011,第3期

机译：印刷电路板通孔和微孔结构对元件热性能的影响
2. Integrated Building Cells for a Simple Modular Design of Electronic Circuits with Reduced External Complexity: Performance, Active Element Assembly, and an Application Example [J] . Roman Sotner, Jan Jerabek, Ladislav Polak, Electronics . 2019,第5期

机译：用于降低外部复杂性的电子电路简单模块化设计的集成构建单元：性能，有源元件组装和应用示例
3. Evaluating the environmental protection strategy of a printed circuit board manufacturer using a T_w fuzzy importance performance analysis with Google Trends [J] . Chen Kuen-Suan, Lin Kuo-Ping, Lin Li-Ju Expert systems with applications . 2020,第Octa期

机译：使用Google趋势的T_W模糊重要性分析评估印刷电路板制造商的环保策略
4. Embedded Active Elements in 3D Printed Structures for the Design of RF Circuits [C] . Mohd Ifwat Mohd Ghazali, Saranraj Karuppuswami, Saikat Mondal, IEEE Electronic Components and Technology Conference . 2018

机译：用于射频电路设计的3D打印结构中的嵌入式有源元件
5. Recent trends in CAD tools for microwave circuit design exploiting space mapping technology. [D] . Mohamed, Ahmed Sayed. 2005

机译：利用空间映射技术的微波电路设计CAD工具的最新趋势。
6. Screen-printed electrode produced by printed-circuit board technology. Application to Cancer Biomarker Detection by means of plastic antibody as sensing material [O] . Felismina T.C. Moreira, M. Judite M.S. Ferreira, José R.T. Puga, -1

机译：通过印刷电路板技术生产的丝网印刷电极。以塑料抗体为检测材料在癌症生物标志物检测中的应用
7. Trends in High Density Packaging Technologies 1. Some Considerations on the Reliability of Copper Circuits in the Build-up Multilayer Printed Wiring Board. [O] . Masahito ISHII 1998

机译：高密度包装技术的趋势1.关于堆积多层印刷配线板中铜路电路可靠性的一些考虑因素。

Recent Trend on Microfabrication of Circuit Technology. Design and Performance of Build up Structure Printed Circuit Board.

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