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Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

机译：表征焊接合金型IN-AG-TI和SIC陶瓷和铜直接焊接的研究

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Roman Koleňák; Igor Kostolný; Jaromír Drápala; Martin Sahul; Ján Urminský;
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1. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper [J] . Roman Koleňák, Igor Kostolny, Jaromír Drápala, Metals . 2018,第4期

机译：表征In-Ag-Ti钎料的特征以及SiC陶瓷和铜的直接钎焊的研究
2. Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper [J] . Roman Koleňák, Igor Kostolný, Martin Kusý Materials Science and Engineering . 2018,第JANa17期

机译：Zn-In-Mg焊接合金的表征及硅铜直接焊接的研究
3. Study of direct soldering of Al 2O 3 ceramics and Cu substrate by use of Bi11Ag2La solder [J] . Roman Koleňák, Erika Hodúlová Welding in the World: Journal of the International Institute of Welding: Journal of the International Institute of Welding . 2018,第2期

机译：Al <下标> 2 O <下标> 3 陶瓷和Cu基板的直接焊接通过使用Bi11AG2LA焊料研究
4. Brazing Sapphire/Sapphire and Sapphire/Copper Sandwich Joints Using Sn-Ag-Ti Active Solder Alloy [C] . Kuiyuan Feng, Dekui Mu, Xinjiang Liao, Electronic Packaging Interconnect Technology Symposium . 2018

机译：使用SN-AG-TI活性焊接合金钎焊蓝宝石/蓝宝石和蓝宝石/铜三明治接头
5. Continuum damage mechanics based failure prediction methodology for tin-silver-copper solder alloy interconnects in electronic packaging . [D] . Pierce, David Michael. 2007

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6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

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7. Alumina Ceramic-to-Nickel Metal Seals by Reactive Alloying Method Utilizing Ti-Ni-Ag Solder [O] . Haruo TAKASHIO 1976

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Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

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