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Development of Printed Circuit Boards Applied with Copper Paste Through-Holes.

机译：用铜浆体孔施加印刷电路板的研制。

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Seiji KATO; Yukihiro TAKATA; Tomomi OKAMOTO; Toshitsugu SHIMAMOTO; Jun-ichi ITO;
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年度 1994
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1. DEVELOPMENT OF DIFFUSION BARRIER LAYER ON COPPER-PRINTED CIRCUIT BOARD USING ELECTROLESS PLATING METHOD [J] . SITI RABIATULL AISHA IDRIS, ALI OURDJINI, AZMAH HANIM MOHAMAD ARIFF, International Journal of Computational Methods and Experimental Measurements . 2015,第4期

机译：化学镀法在铜基电路板上扩散阻挡层的开发
2. Process development for recovery of copper and precious metals from waste printed circuit boards with emphasize on palladium and gold leaching and precipitation [J] . Ali Behnamfard, Mohammad Mehdi Salarirad, Francesco Veglio Waste Management . 2013,第11期

机译：从废印刷电路板中回收铜和贵金属的工艺开发，重点是钯和金的浸出和沉淀
3. Flexible copper wires through galvanic replacement of zinc paste: a highly cost-effective technology for wiring flexible printed circuits [J] . Liu Jingping, Yang Cheng, Zou Peichao, Journal of Materials Chemistry, C. materials for optical and electronic devices . 2015,第32期

机译：通过电镀替代锌浆的柔性铜线：一种用于布线柔性印刷电路的极具成本效益的技术
4. Analysis of Pin in Paste Soldering on Printed Circuits Boards Assembly Using Lead Free Solder Paste [C] . R. B. Lima, V. F. Cardoso, A. N. R. da Silva Microelectronics technology and devices - SBMicro 2011 . 2011

机译：无铅焊膏分析印刷电路板组装中的焊膏引脚
5. Microstructure and mechanical properties of electroless copper and their influence on the reliability of printed-circuit boards. [D] . Lin, Kuanchih. 1990

机译：化学镀铜的微观结构和机械性能及其对印刷电路板可靠性的影响。
6. Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms [O] . Philipp Nothdurft, Gisbert Riess, Wolfgang Kern 2019

机译：印刷电路板中的铜/环氧树脂接头：制造和界面破坏机制
7. Special Articles: Design for Printed Circuit Boards and Its Electromagnetic Characteristics. 2. Noise Reduction Techniques. Reduction of EMI from Printed Wiring Boards by Using Copper Paste. [O] . Shigeki MATSUNAGA 1992

机译：特殊用品：印刷电路板设计及其电磁特性。 2.降噪技术。使用铜浆料从印刷线板上减少EMI。

Development of Printed Circuit Boards Applied with Copper Paste Through-Holes.

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